Heightened flexible circuit board of bonding pad and manufacturing method thereof

Abstract

The invention discloses a heightened flexible circuit board of a bonding pad and a manufacturing method thereof. The manufacturing method comprises the following steps: (a) a flexible substrate is provided; (b) a heightened part is disposed at a preset position on the substrate, and the heightened part is a metallic conductor and generally adopts copper with better electric conductivity; (c) a circuit layer is disposed on the substrate in an etching way, is electrically connected with the lower part of the heightened part and generally adopts copper with better electric conductivity; and (d) an insulating layer is disposed on the circuit layer to prevent the circuit layer from being oxidized and influenced by environmental temperature and humidity. The top of the heightened part protrudes from or is flushed with the upper surface of the insulating layer so as to realize electrical connection with chip pins. The heightened flexible circuit board of a bonding pad can solve the problems existing in the prior art and can realize reliable connection with a chip to be encapsulated.

Description

technical field [0001] The invention relates to the field of electronic devices, in particular to a flexible circuit board used for a camera module and a manufacturing method thereof. Background technique [0002] COB technology (chip direct mounting technology) is one of the bare chip mounting technologies. It was first used in digital clocks and watches, and now it has been widely used in digital cameras, calculators, various smart cards, printer modules, and computer motherboards. In the field of science and technology, the CMOS backplane group of the mobile phone camera, which is currently developing rapidly, also uses COB technology. COB technology uses adhesives or automatic strip welding, wire welding, flip-chip welding and other methods to directly mount the integrated circuit chip on the mounting position of the circuit board, and cover it with other materials such as silicone or epoxy resin to ensure reliability. The chip can also be sealed with a plastic or metal...

AI Technical Summary

Problems solved by technology

In the packaging of the CMOS backplane group of the mobile phone camera, the CMOS chip is usually crimped at the pad opening 4 with conductive glue, so that the CMOS chip and the circuit layer 2 on the substrate 1 form a conductive circuit, and the circuit layer 2 on the substrate 1 Due to the covering of the insulating layer 3, it is necessary to overcome the thickness of the insulating layer 3 in the process of crimping the conductive adhesive to make the chip and the circuit layer 2 conduct, so that the reliability of the combination of the chip and the circuit layer 2 cannot be guaranteed. To a certain extent, it affects the yield rate of the chip package, making the overall cost of the camera module higher

Images