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Liquid resin composition for electronic part sealing and electronic part apparatus utilizing the same

A technology of electronic components and liquid resins, applied in the direction of electrical components, electrical solid devices, semiconductor/solid device parts, etc., can solve the problems of reduced adhesion, difficulty in adjusting curing, accelerating curing, etc., and achieve thermal shock resistance Excellent performance, excellent fillet weld formation, shortening gel time effect

Inactive Publication Date: 2009-09-02
RESONAC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005]As mentioned above, it is relatively easy to adjust the curability of the conventional anhydride-based curing agent, but it is generally difficult to adjust the curability of the amine-based curing agent, because it accelerates Curability, resulting in a problem of reduced adhesion

Method used

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  • Liquid resin composition for electronic part sealing and electronic part apparatus utilizing the same
  • Liquid resin composition for electronic part sealing and electronic part apparatus utilizing the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～8、 comparative example 1～7

[0119] Mix the following ingredients according to the compositions (parts by weight) shown in the following Tables 1 to 2 respectively, knead and disperse them with three rollers and a vacuum attritor, and then prepare electronic components of Examples 1 to 8 and Comparative Examples 1 to 7. Liquid resin composition for sealing parts.

[0120] The liquid resin compositions for electronic component sealing of Examples 1-8 and Comparative Examples 1-7 were evaluated by various characteristic tests of said (1)-(11). The evaluation results are shown in Tables 1 to 2 below. Also, blank columns in the table indicate no fit.

[0121] For each component in the table, the following substances were used.

[0122] (epoxy resin)

[0123] Epoxy resin 1: a liquid diepoxy resin having an epoxy equivalent of 160 obtained by epoxidizing bisphenol F (manufactured by Tohto Chemical Co., Ltd., trade name "YDF-8170C")

[0124] Epoxy resin 2: a trifunctional liquid epoxy resin (manufactured by ...

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Abstract

The invention provides a liquid resin composition for electronic part sealing that is good in fluidity in a narrow gap, being free from void generation, and that excels in fillet formation; and an electronic part apparatus sealed thereby of high reliability (moisture resistance and thermal shock resistance). The liquid resin composition for electronic part sealing is characterized by containing (A) epoxy resin including a liquid epoxy resin, (B) hardening agent including a liquid aromatic amine, (C) hydrazide compound of less than 2 [mu]m average particle diameter and (D) inorganic filler of less than 2 [mu]m average particle diameter.

Description

technical field [0001] The present invention relates to a liquid resin composition for electronic component sealing and an electronic component device using the same. Background technique [0002] Conventionally, in the field of element sealing of electronic component devices such as transistors and ICs, from the viewpoints of productivity and cost, sealing with resin has been the mainstream, and epoxy resin compositions have been widely used. The reason for this is that epoxy resins are well-balanced in properties such as workability, moldability, electrical properties, moisture resistance, heat resistance, mechanical properties, and adhesion to inserts. Liquid resin compositions for encapsulation of electronic components are widely used as sealing materials in semiconductor devices mounted with bare chips such as COB (chip on board), COG (chip on glass), and TCP (tape carrier package). In addition, semiconductor devices (flip-chip method) in which semiconductor elements a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/56H01L23/29H01L23/31
CPCC08G59/5033H01L2924/01019H01L2224/73203H01L2924/0102H01L23/295H01L2924/01004C08G59/4035H01L21/563H01L2924/01087H01L2924/01012H01L2924/09701H01L23/293H01L2924/1301H01L2924/13034Y10T428/25Y10T428/249994H01L2924/00H01L2924/00014C08G59/56C08K3/00C08L63/00H01L23/29
Inventor 土田悟萩原伸介天童一良
Owner RESONAC CORP
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