Micro inertial sensor embedded with movable electrode and manufacturing method thereof

Abstract

The invention relates to a solenoid drive micro inertial sensor embedded with movable comb teeth and grid-shaped electrode, and a manufacturing method thereof. The invention comprises a glass substrate, a movable sensor mass block and four fixed mass blocks, wherein, the movable sensor mass block is provided symmetrically with three pairs of through grooves from the edge to the center thereof, the three pairs of through grooves can divide the movable sensor mass block into two fixed parts and two movable parts in the middle, wherein, silicon sheets are arranged symmetrically at the two sides of the movable parts, comb-testing silicon sheets and the three movable silicon sheets are arranged in an intersect manner. A metal driving lead is arranged between a U-shaped groove of the movable part of the movable sensor mass block and grid sheets, the surface of the glass substrate is provided with an interdigital aluminium electrode corresponding to the movable sensor mass block. The invention has simple manufacture craft and is conducive to lowering cost and improving yield.

Description

technical field [0001] The invention belongs to the technical field of microelectronic machinery, relates to a micromechanical capacitive inertial sensor, in particular to an electromagnetically driven microinertial sensor embedded with movable comb teeth and grid-shaped electrodes and a manufacturing method thereof. Background technique [0002] In recent ten years, accelerometers made with micromechanical technology have been developed rapidly. Its main acceleration detection technologies include piezoresistive detection, piezoelectric detection, thermal detection, resonance detection, electromagnetic detection, light detection, tunnel current detection and capacitance detection. In addition, there are accelerometers based on other detection technologies, such as optical accelerometers, electromagnetic accelerometers, and capacitive accelerometers. The development of optical accelerometers is mainly to combine the advantages of light and micromechanics to make sensors wit...

AI Technical Summary

Problems solved by technology

For comb-shaped capacitive sensors processed by bulk silicon technology such as deep reactive particle etching (Deep RIE), the aspect ratio of the plate capacitance is generally less than 30:1, which limits the increase in the mass of the sensor vibrator and the Reduced plate spacing

For small-pitch plate capacitors, the pressure film air damping is relatively large, which increases the mechanical noise of the sensor

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