Method for production of metal-coated polyimide resin substrate having excellent thermal aging resistance property

A technology of coating polyimide resin and polyimide resin, which is applied in chemical instruments and methods, improvement of metal adhesion of insulating substrates, liquid chemical plating, etc., can solve the problem of difficulty in forming fine patterns, poor etchability, etc. problem, to achieve the effect of improving adhesion and improving heat aging resistance

Inactive Publication Date: 2009-09-30
JX NIPPON MINING & METALS CO LTD
View PDF3 Cites 12 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] In addition, it has been proposed to use a Ni-P system electroless nickel plating solution as a commonly used electroless nickel plating solution. Although the formed Ni-P system electroless nickel coating film has excellent corrosion resistance, it also has poor etching properties and is difficult to form fine patterns. question

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for production of metal-coated polyimide resin substrate having excellent thermal aging resistance property

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] As a hydrophilic treatment, a polyimide resin film (DuPont: Kapton 150E) was immersed in a 100 g / L potassium hydroxide aqueous solution at 25° C. for 3 minutes, and then washed with pure water. As a catalyst imparting process, immerse at 50° C. for 10 minutes in a solution (Nikko Metal Co., Ltd.: PM-A) obtained by mixing or reacting a silane coupling agent having a functional group having metal trapping performance and a noble metal compound in advance, Then wash with pure water. Thereafter, as a catalyst activation treatment, the catalyst was immersed in a reducing agent solution (Nikko Metal Co., Ltd.: PM-B) at 50°C for 3 minutes, and then washed with pure water.

[0048] As the first plating step, a nickel-boron electroless plating solution (Nikko Metal Plating Co., Ltd.: Nicom HB) was used to form a 0.19 μm nickel layer (containing 1.6% by weight B) as shown in Table 1, and pure Wash with water. Then, moisture was removed, and then heat treatment was performed at ...

Embodiment 2

[0053] In the nickel plating step of Example 1, as the first plating step, a nickel-boron electroless plating solution (Nikko Metal Plating Co., Ltd.: Nicom HB) was used to form a nickel layer of 0.24 μm (containing 1.4% by weight of B). , and wash with pure water. Furthermore, moisture was removed, and heat-processing was performed in air|atmosphere at 150 degreeC for 10 minutes after that.

[0054] Next, as a second plating step, a nickel layer of 0.01 μm was formed using the same nickel plating solution as above to form a nickel layer of 0.25 μm in total (first plating+second plating). The ratio of the thickness of the first nickel layer to the total thickness reaches 96%.

[0055] Except for this, the same process as in Example 1 was performed. Table 1 also shows the measurement results such as the peel strength at the time of 90° peeling.

[0056] As a result, the normal peel strength was 0.54 kN / m, the peel strength after aging at 150° C. for 7 days was 0.34 kN / m, and...

Embodiment 3

[0060] In the nickel plating step of Example 1, as the first plating step, a nickel-boron electroless plating solution (Nikko Metal Plating Co., Ltd.: Nicom HB) was used to form a nickel layer of 0.14 μm (containing 1.6% by weight of B). , and wash with pure water. Furthermore, after removing moisture, heat treatment was performed in the air at 150° C. for 10 minutes.

[0061] Next, as a second plating step, a nickel layer of 0.11 μm was formed using the same nickel plating solution as above to form a nickel layer of 0.25 μm in total (first plating+second plating). The ratio of the thickness of the first nickel layer to the total thickness reaches 56%.

[0062] Except for this, the same process as in Example 1 was performed. Table 1 also shows the measurement results such as the peel strength at the time of 90° peeling.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Normal peel strengthaaaaaaaaaa
Peel strengthaaaaaaaaaa
Peel strengthaaaaaaaaaa
Login to view more

Abstract

Disclosed is a method for producing a metal-coated polyimide resin substrate, which comprises: forming an electroless nickel-plated layer containing a component (B) on both surfaces or one surface of a polyimide resin film; and forming an electrically conductive film on the surface of the electroless nickel-plated layer by the electroless copper plating or the electro copper plating. The method is characterized as follows. Prior to the electroless nickel plating, a treatment of immersing the polyimide resin substrate in a solution comprising an alkali metal hydroxide to thereby render the polyimide resin substrate hydrophilic, a catalyst addition treatment, and a catalyst activation treatment are conducted. The process for forming the electroless nickel layer is divided into two steps. In the first step, an electroless nickel-plated layer having a larger thickness than that formed in the second step is formed, and the resulting layer is subjected to a heat treatment. In the second step, a procedure for forming an electroless nickel-plated layer is conducted again. The method enables to increase the adhesion after thermal aging (i.e., after allowing to left in the atmosphere at 150 DEG C for 168 hours) without deteriorating the initial adhesion which is a measure of the adhesion force of a non-adhesive flexible laminate.

Description

technical field [0001] The present invention relates to a method for producing an adhesive-free flexible laminate used as a mounting material for electronic components such as flexible printed circuit boards, TABs, and COFs, especially a metal-clad polyimide resin substrate excellent in heat aging resistance. Background technique [0002] FCCL (Flexible Copper Clad Laminate), which is formed by laminating a metal conductor layer mainly containing copper on a polyimide film, is widely used as a raw material for circuit boards in the electronics industry. Among them, an adhesive-free flexible laminate (particularly a two-layer flexible laminate) that does not have an adhesive layer between a polyimide film and a metal layer has attracted attention as circuit wiring widths have become finer pitches. [0003] As a method of manufacturing adhesive-free flexible laminates, especially adhesive-free flexible laminates that meet the requirements of fine spacing, there is a so-called ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C23C18/52B32B15/088C23C18/20H05K3/00H05K3/38
CPCH05K2203/1476H05K3/381H05K2201/0344C23C18/32C25D7/00H05K2203/1105H05K1/0346C23C18/38H05K3/181H05K2203/0793H05K3/389H05K2201/0154H05K3/28C23C18/1651C23C18/1653C23C18/1641C23C18/206
Inventor 吉田拓河村寿文
Owner JX NIPPON MINING & METALS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap