Optical bonding composition for led light source

A technology of LED light source and adhesive layer, applied in the field of LED light source, can solve the problems of affecting the function of the LED light source, limiting the effectiveness, hindering the use of the extractor, etc.
CN101548398AInactive Publication Date: 2009-09-303M INNOVATIVE PROPERTIES CO

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
3M INNOVATIVE PROPERTIES CO
Publication Date
2009-09-30
Estimated Expiration
Not applicable · inactive patent

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The present invention discloses an optical bonding composition and LED light source comprising the composition, as well as a method of making the LED light source. The LED light source may comprise: an LED die; an optical element optically coupled to the LED die; and a bonding layer comprising an amorphous organopolysiloxane network, the organopolysiloxane network comprising a silsesquioxane portion derived from (RSiO1.5)n wherein R is an organic group and n is an integer of at least 10; the bonding layer bonding the LED die and the optical element together. Efficiency of the LED light source may be increased when using an optical extractor as the optical element.
Need to check novelty before this filing date? Find Prior Art

Description

[0001] Cross references to related patent applications

[0002] This patent application claims priority to US Provisional Patent Application No. 60 / 866448, filed November 20, 2006, the disclosure of which is incorporated herein by reference in its entirety. technical field

[0003] The present invention relates to LED light sources, and more particularly to LED light sources having an optical element bonded to an LED die using an optical bonding composition. Background technique

[0004] LED light sources have the inherent potential to provide the brightness, output and operating life of conventional light sources. Unfortunately, LED light sources generate light in a semiconductor material commonly referred to as an LED die, and it is difficult to efficiently extract light from the LED die without substantially reducing brightness or increasing the apparent light-emitting area of ​​the LED light source. This difficulty typically arises from a large refractive index mismatc...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More