Optical bonding composition for led light source
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- 3M INNOVATIVE PROPERTIES CO
- Publication Date
- 2009-09-30
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
[0001] Cross references to related patent applications
[0002] This patent application claims priority to US Provisional Patent Application No. 60 / 866448, filed November 20, 2006, the disclosure of which is incorporated herein by reference in its entirety. technical field
[0003] The present invention relates to LED light sources, and more particularly to LED light sources having an optical element bonded to an LED die using an optical bonding composition. Background technique
[0004] LED light sources have the inherent potential to provide the brightness, output and operating life of conventional light sources. Unfortunately, LED light sources generate light in a semiconductor material commonly referred to as an LED die, and it is difficult to efficiently extract light from the LED die without substantially reducing brightness or increasing the apparent light-emitting area of ​​the LED light source. This difficulty typically arises from a large refractive index mismatc...