Low-temperature fast curing polyester moulding compound and preparation method thereof

A rapid curing, molding compound technology, applied in the field of composite insulating materials, can solve the problems of high molding temperature, limited promotion and application, long curing time, etc., and achieve the effect of improving strength and heat resistance

Active Publication Date: 2009-11-11
无锡新宏泰电器科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Polyester molding compound is a glass fiber-reinforced resin-based composite material. It is favored by many fields such as electrical appliances, construction, transportation, and aviation because of its excellent mechanical pr

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] Proportioning raw materials according to the following parts by weight:

[0039] 50 parts of unsaturated polyester resin, 50 parts of low shrinkage additive, 3 parts of viscosity reducer, 8 parts of liquid pigment, 1.0 part of 1# curing agent, 1.5 parts of 2# curing agent, 0.3 part of compound inhibitor, 180 parts of filling material part, 5 parts of release agent, 60 parts of non-alkali chopped glass fiber, stand-by.

[0040] Wherein: the unsaturated polyester resin is o-phthalic unsaturated polyester resin, wherein the unsaturated polyester accounts for 65% to 70% by weight, and the rest is styrene solution;

[0041] The low-shrinkage additive is obtained by mixing and melting commercially available polystyrene and a monomeric styrene solution with a concentration of 55% to 65%, wherein polystyrene accounts for 45% by weight, and the monomeric styrene solution accounts for 55% by weight share;

[0042] Described viscosity reducer is the BYK-W-996 type sizing agent t...

Embodiment 2

[0057] Proportioning raw materials according to the following parts by weight:

[0058] 70 parts of unsaturated polyester resin, 30 parts of low shrinkage additive, 5 parts of viscosity reducer, 10 parts of liquid pigment, 2.0 parts of 1# curing agent, 0.5 part of 2# curing agent, 0.5 part of compound inhibitor, 220 parts of filling material part, 6 parts of mold release agent, 90 parts of non-alkali chopped glass fiber, stand-by.

[0059] Proportioning raw materials according to the following parts by weight:

[0060] 50 parts of unsaturated polyester resin, 50 parts of low shrinkage additive, 3 parts of viscosity reducer, 8 parts of liquid pigment, 1.0 part of 1# curing agent, 1.5 parts of 2# curing agent, 0.3 part of compound inhibitor, 180 parts of filling material part, 5 parts of release agent, 60 parts of non-alkali chopped glass fiber, stand-by.

[0061]Wherein: the unsaturated polyester resin is o-phthalic unsaturated polyester resin, wherein the unsaturated polyest...

Embodiment 3

[0078] Proportioning raw materials according to the following parts by weight:

[0079] 60 parts of unsaturated polyester resin, 40 parts of low-shrinkage additive, 4 parts of viscosity reducer, 8 parts of liquid pigment, 1.5 parts of 1# curing agent, 1 part of 2# curing agent, 0.4 parts of compound inhibitor, filling material 200 parts, 5 parts of release agent, 70 parts of non-alkali chopped glass fiber.

[0080] Wherein: the unsaturated polyester resin is o-phthalic unsaturated polyester resin, wherein the unsaturated polyester accounts for 65% to 70% by weight, and the rest is styrene solution;

[0081] The low-shrinkage additive is obtained by mixing and melting commercially available polystyrene and a monomeric styrene solution with a concentration of 55% to 65%, wherein the polystyrene accounts for 55% by weight, and the monomeric styrene solution accounts for 45% by weight share;

[0082] Described viscosity reducer is the BYK-W-996 type sizing agent that selects Ger...

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PUM

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Abstract

The invention discloses a low-temperature fast curing polyester moulding compound and preparation method thereof. The solidification process of the material is adjusted by mixing and matching multiple solidified agents and being aided with novel compound polymerization retardor, the demoulding flatness of materials is improved by adding a novel viscosity reduction impregnating compound, and the material moulding process is improved by adding the predispersed step of adding little fiber after the solidifying system, thus ensuring that the moulding temperature obviously reduce to be only 110 DEG C to 130 DEG C on the condition that the polyester moulding compound reserves the original favorable feature; and meanwhile, the solidifying period is shortened to be 8 to 10 S/mm, thus saving the energy and reduces the manufacturing cost for enterprises. The polyester moulding compound of the invention is an energy-saving environmental protection material with excellent mechanical behavior, electrical property and heat resistance. The polyester moulding compound is widely suitable for electrical equipment, instruments and automobile manufacture field, aviation field, traffic field, building field, etc.

Description

technical field [0001] The invention relates to the field of composite insulating materials, in particular to a low-temperature fast-curing polyester molding compound and a preparation method thereof. Background technique [0002] Polyester molding compound is a glass fiber-reinforced resin-based composite material. It is favored by many fields such as electrical appliances, construction, transportation, and aviation because of its excellent mechanical properties, electrical properties, and heat resistance. However, its high molding The temperature and long curing time keep the production cost high for a long time, which limits further popularization and application to a certain extent. Contents of the invention [0003] The purpose of the present invention is to provide a low-temperature fast-curing polyester molding compound with low molding temperature and short curing time while maintaining the original excellent performance, so as to save energy and reduce production ...

Claims

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Application Information

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IPC IPC(8): C08L67/06C08K13/02C08K5/14C08K5/13C08K5/08
Inventor 夏宏伟赵敏海冯伟祖肖新倪新梅吴玉亚
Owner 无锡新宏泰电器科技股份有限公司
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