High-power LED lamp based on heat pipe for thermal conductivity

A LED lamp, high-power technology, applied in the direction of semiconductor devices, lighting and heating equipment, components of lighting devices, etc., can solve the problems of large thermal resistance, small radiator contact surface, complex circuit design, etc., to achieve enhanced heat dissipation effect , expand the scope of use, improve the effect of cooling efficiency

Inactive Publication Date: 2009-11-11
ZHEJIANG MINGXIN SEMICON TECH
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  • Abstract
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  • Application Information

AI Technical Summary

Problems solved by technology

One is to use a low-power LED array as the illuminant, but low-power LEDs have large light attenuation, complex circuit design, high installation costs, and difficulties in light distribution control
The other uses high-power LED chips to be integrated and packaged in a metal base, and an optical cup is arranged on the base. This package structure has high light efficiency and is easy to control the luminous angle. However, the existing problem is that the problem of heat dissipation has not been resolved solve
The bottom plane of the existing high-power LED base is conne

Method used

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  • High-power LED lamp based on heat pipe for thermal conductivity
  • High-power LED lamp based on heat pipe for thermal conductivity
  • High-power LED lamp based on heat pipe for thermal conductivity

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[0026] The technical solution of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0027] like figure 1 , 2 Shown, the present invention comprises LED chip, chip base 46, the cooling device that links to each other with chip base 46 and the light distribution device that is located on the chip base 46; The heat pipe 43 of the chip base 46; the chip base 46 is correspondingly provided with a plurality of inner grooves 47 matched with the heat pipe 43 for accommodating the heat pipe 43, and the inner groove 47 can be semicircular, "V" Shaped, "U" shaped or polygonal groove, in this embodiment a semicircular inner groove 47 is used, so that the circular heat pipe 43 can be closely attached to the wall of the inner groove 47, and lead-free tin A layer of flux welds the two together. The chip is covered on the chip base 46 by thermally conductive silver paste.

[0028]The light distribution device comprises a light ...

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Abstract

The invention discloses a high-power LED lamp based on a heat pipe for thermal conductivity and relates to an LED lamp. The prior high-power LED lamp has unsatisfactory heat transference and poor heat dissipation effect. The high-power LED lamp comprises an LED chip, a chip base, a heat dissipation device which is connected with the chip base and a light distribution device which is arranged on the chip base. The high-power LED lamp is characterized in that the heat dissipation device comprises a heat radiator and a plurality of heat pipes which connect the heat radiator with the chip base; and a plurality of inner grooves which are matched with the heat pipes are correspondingly formed on the chip base for containing the heat pipes, and a metal welding layer is arranged between the inner grooves and the heat pipes for connecting the chip base which is covered by the chip with the heat radiation device so as to form an integrated light source. The technical method has good heat conduction effect, rapid heat dissipation and reliable connection.

Description

【Technical field】 [0001] The invention relates to an LED lamp, especially a high-power LED lamp based on heat conduction of a heat pipe. 【Background technique】 [0002] LED lamps have the advantages of energy saving, high efficiency, and long life. Today, with increasing attention to energy conservation, the application fields of high-power LED lamps continue to expand. The products have involved landscape lighting, miner's lamps, street lamps and emergency lamps. [0003] At present, there are two manufacturing methods for high-power LED light sources. One is to use a low-power LED array as the illuminant, but low-power LEDs have large light attenuation, complex circuit design, high installation costs, and difficult light distribution control. The other uses high-power LED chips to be integrated and packaged in a metal base, and an optical cup is arranged on the base. This package structure has high light efficiency and is easy to control the luminous angle. However, the e...

Claims

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Application Information

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IPC IPC(8): F21S2/00F21V29/00F21V19/00F21V5/04F21V17/00F21V15/04H01L23/34H01L23/427F21Y101/02F21K9/00F21V29/51F21V29/71F21V29/76F21V29/89F21Y115/10
CPCH01L2924/0002
Inventor 苏光耀胡敏
Owner ZHEJIANG MINGXIN SEMICON TECH
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