High-power LED lamp based on heat pipe for thermal conductivity

Abstract

The invention discloses a high-power LED lamp based on a heat pipe for thermal conductivity and relates to an LED lamp. The prior high-power LED lamp has unsatisfactory heat transference and poor heat dissipation effect. The high-power LED lamp comprises an LED chip, a chip base, a heat dissipation device which is connected with the chip base and a light distribution device which is arranged on the chip base. The high-power LED lamp is characterized in that the heat dissipation device comprises a heat radiator and a plurality of heat pipes which connect the heat radiator with the chip base; and a plurality of inner grooves which are matched with the heat pipes are correspondingly formed on the chip base for containing the heat pipes, and a metal welding layer is arranged between the inner grooves and the heat pipes for connecting the chip base which is covered by the chip with the heat radiation device so as to form an integrated light source. The technical method has good heat conduction effect, rapid heat dissipation and reliable connection.

Description

【Technical field】 [0001] The invention relates to an LED lamp, especially a high-power LED lamp based on heat conduction of a heat pipe. 【Background technique】 [0002] LED lamps have the advantages of energy saving, high efficiency, and long life. Today, with increasing attention to energy conservation, the application fields of high-power LED lamps continue to expand. The products have involved landscape lighting, miner's lamps, street lamps and emergency lamps. [0003] At present, there are two manufacturing methods for high-power LED light sources. One is to use a low-power LED array as the illuminant, but low-power LEDs have large light attenuation, complex circuit design, high installation costs, and difficult light distribution control. The other uses high-power LED chips to be integrated and packaged in a metal base, and an optical cup is arranged on the base. This package structure has high light efficiency and is easy to control the luminous angle. However, the e...

AI Technical Summary

Problems solved by technology

One is to use a low-power LED array as the illuminant, but low-power LEDs have large light attenuation, complex circuit design, high installation costs, and difficulties in light distribution control

The other uses high-power LED chips to be integrated and packaged in a metal base, and an optical cup is arranged on the base. This package structure has high light efficiency and is easy to control the luminous angle. However, the existing problem is that the problem of heat dissipation has not been resolved solve

The bottom plane of the existing high-power LED base is connected to the heat sink of the die-casting aluminum base (or aluminum profile) by screwing or bonding, and the heat of the base is transferred to the heat sink. Because the bottom surface of the base is flat, its The contact surface with the heat sink is small, the thermal resistance is large, and the heat transfer is not ideal. When the base is connected to the heat sink by bonding, due to the low thermal conductivity of the adhesive layer, it is equivalent to the gap between the base and the heat sink. Added a thermal resistance, the heat dissipation is not satisfactory

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