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Method for preparing capillary electrophoresis chip

A technology of capillary electrophoresis and chips, which is applied in the manufacture of microstructure devices, material analysis through electromagnetic means, decorative art, etc., can solve the problems of difficult to produce a wide range of sizes, and achieve easy mass production, easy manufacturing process, and transparent high light effect

Inactive Publication Date: 2011-04-13
SHANGHAI JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These methods have the characteristics of easy and fast fabrication, but it is difficult to produce biochips with a wide size range, especially micro-sized and high-quality images

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Step 1, cleaning the glass substrate, drying, sputtering Cr on the substrate as an adhesion layer, sputtering Cu on the adhesion layer as a seed layer, and laminating the adhesion layer and the seed into the first adhesion-seed layer;

[0026] Step 2, throwing the first photoresist on the first adhesion-seed layer, baking the glue, and photolithographically supporting the structural pattern of the column on the first photoresist;

[0027] The thickness of the first photoresist is 5 μm;

[0028] Step 3, electroplating the support column in the cavity of the structural pattern of the support column, the thickness of the electroplating is the same as the thickness of the first photoresist; the electroplated metal is Au;

[0029] Step 4, sputtering Cr on the first photoresist and the support column as an adhesion layer, sputtering Cu on the adhesion layer as a seed layer, and laminating the adhesion layer and the seed into a second adhesion-seed layer;

[0030] Step 5, thr...

Embodiment 2

[0037] Step 1, cleaning the glass substrate, drying, sputtering Cr on the substrate as an adhesion layer, sputtering Cu on the adhesion layer as a seed layer, and laminating the adhesion layer and the seed into the first adhesion-seed layer;

[0038] Step 2, throwing the first photoresist on the first adhesion-seed layer, baking the glue, and photolithographically supporting the structural pattern of the column on the first photoresist;

[0039] The thickness of the first photoresist is 30 μm;

[0040] Step 3, electroplating the support column in the cavity of the structural pattern of the support column, the thickness of the electroplating is the same as the thickness of the first photoresist; the electroplated metal is Au;

[0041] Step 4, sputtering Cr on the first photoresist and the support column as an adhesion layer, sputtering Cu on the adhesion layer as a seed layer, and laminating the adhesion layer and the seed into a second adhesion-seed layer;

[0042] Step 5, th...

Embodiment 3

[0049] Step 1, cleaning the glass substrate, drying, sputtering Cr on the substrate as an adhesion layer, sputtering Cu on the adhesion layer as a seed layer, and laminating the adhesion layer and the seed into the first adhesion-seed layer;

[0050] Step 2, throwing the first photoresist on the first adhesion-seed layer, baking the glue, and photolithographically supporting the structural pattern of the column on the first photoresist;

[0051] The thickness of the first photoresist is 50 μm;

[0052] Step 3, electroplating the support column in the cavity of the structural pattern of the support column, the thickness of the electroplating is the same as the thickness of the first photoresist; the electroplated metal is Au;

[0053] Step 4, sputtering Cr on the first photoresist and the support column as an adhesion layer, sputtering Cu on the adhesion layer as a seed layer, and laminating the adhesion layer and the seed into a second adhesion-seed layer;

[0054] Step 5, th...

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Abstract

The invention discloses a method for preparing a capillary electrophoresis chip in the technical field of micro machining. The method comprises the following steps: preparing a first adhesive-seed layer; spinning a first photoresist, baking the photoresist, and photoetching a structural graph of a support upright post; electroplating the support upright post in a cavity of the structural graph ofthe support upright post; preparing a second adhesive-seed layer; spinning a second photoresist, baking the photoresist, and photoetching a capillary electrophoresis chip graph; electroplating the capillary electrophoresis chip in a cavity of the capillary electrophoresis chip graph; removing the second photoresist layer and the second adhesive-seed layer in turn to obtain a suspended metal tube netlike structure; using the metal tube netlike structure as a cathode and an inert metal as an anode, soaking the metal tube netlike structure and the inert metal into cathode electrophoresis solution, and electrifying the solution to obtain a film wrapped metal tube netlike structure; and opening two holes on a film, then sintering the film wrapped metal tube netlike structure, and corroding thesintered structure to obtain the capillary electrophoresis chip. The capillary chip manufactured by the method has high precision and is easy for large batch production.

Description

technical field [0001] The invention relates to a method for preparing a chip in the technical field of micromachining, in particular to a method for preparing a capillary electrophoresis chip. Background technique [0002] Capillary Electrophoresis chip (CEC) is a new type of microanalysis device that has appeared in recent years. The basic device of capillary electrophoresis is to apply high pressure at both ends of the capillary filled with electrolyte, because molecules with different molecular weights and charges have different swimming speeds in it, so as to achieve the purpose of material separation. The capillary electrophoresis chip has the advantages of high efficiency, rapidity, less sample consumption, and saving medicines. [0003] Zhang Liguo, Chen Di, Yang Fan, etc. mentioned in the "DEM technology-based plastic capillary electrophoresis chip processing technology" published in "Microfabrication Technology" No. 4, 2002, pages 61-65, using inductively coupled ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81C1/00G01N27/447
Inventor 丁桂甫姚锦元程吉凤吴日新宿智娟
Owner SHANGHAI JIAOTONG UNIV
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