LED packaging method for high-power LED lighting fixtures

Abstract

The invention discloses an LED packaging method for high-power LED lighting fixtures, which comprises the steps: (1) selecting a rigid substrate or a flexible substrate as a substrate, setting a receiving hole of an LED light source on the substrate, and distributing connecting circuits on the surface; (2) covering an insulating film layer on the surface of the substrate (1) distributed with the connecting circuits to form an LED circuit board; (3) performing welding connection on pins of the LED light source and the connecting circuits on the LED circuit board; (4) adhering the LED circuit board to a radiator of a lamp by adopting high temperature resistant strong glue; and (5) ensuring that the LED light source passes through the receiving hole on the LED circuit board and is directly packaged on the surface of the radiator, and adopting a high thermal conductivity bonding material for thermocontact connection between the LED light source and the surface of the radiator. The process method is advanced and simple, has the advantages of novel, reasonable and compact structure, easy production and manufacture, low cost, and convenient use, installation and maintenance, is suitable for the high-power LED lighting fixtures, and is convenient for popularization and application.

Description

technical field [0001] The invention discloses an LED packaging method which is convenient for high-efficiency heat dissipation and is mainly applied to high-power LED lighting lamps, and belongs to the technical field of semiconductor lighting. Background technique [0002] Most of the current LED lighting products are arranged and packaged with multiple LEDs on the whole substrate first, and pre-wired on the substrate to connect the LED light source packaged on it, and then place the substrate on the lamp body Internally connected into the lighting circuit. Therefore, the LED light source is not directly connected to the lamp body, and a layer of substrate is separated between the two. [0003] The LED substrates used in the field of LED lighting are mainly divided into conventional PCB substrates (mainly paper, fiber, resin substrates), ceramic substrates and metal substrates (mainly aluminum alloy substrates) in terms of materials. [0004] High-power LEDs are heat-gen...

AI Technical Summary

Problems solved by technology

Conventional PCB substrates and ceramic substrates have large thermal resistance and are basically unable to dissipate the heat generated by LED light sources, so they are not suitable for high-power LEDs

The thermal conductivity of the metal substrate is relatively good, but this kind of LED substrate is not directly exposed to the outside world, and the substrate needs to be fixed on the surface of the radiator, and the heat is released to the outside through the radiator, so the contact between the metal substrate and the radiator The surface requirements are very high. At the same time, there are unavoidable gaps between the LED light source and the substrate, and between the substrate and the mounting surface of the heat sink. Therefore, it is also necessary to fill the fluid thermal grease to form "LED light source→thermal grease→metal substrate → heat conduction grease → heat sink → outside” heat dissipation path, this heat dissipation path is multiple indirect heat dissipation, the effect is not obvious, and at the same time, the flatness, smoothness and installation requirements of each contact surface in the heat dissipation path are high, increasing Reduce the processing difficulty and processing cost; each contact surface is prone to contact gaps, resulting in a decrease in the overall effective thermal conductivity, resulting in an increase in LED junction temperature, increased light decay, and reduced the service life of the LED light source

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