LED packaging method for high-power LED lighting fixtures

A technology of LED lighting and LED packaging, which is applied in the direction of lighting devices, cooling/heating devices of lighting devices, components of lighting devices, etc. Reduce the service life of LED light sources and other issues, and achieve the effect of easy modularization and modularization, broadening the scope of application, and novel, reasonable and compact structure

Inactive Publication Date: 2009-12-02
史杰
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Conventional PCB substrates and ceramic substrates have large thermal resistance and are basically unable to dissipate the heat generated by LED light sources, so they are not suitable for high-power LEDs
The thermal conductivity of the metal substrate is relatively good, but this kind of LED substrate is not directly exposed to the outside world, and the substrate needs to be fixed on the surface of the radiator, and the heat is released to the outside through the radiator, so the contact between the metal substrate and the radiator The surface requirements are very high. At the same time, there are unavoidable gaps between the LED light source and the substrate, and between the substrate and the mounting surface of the heat sink.

Method used

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  • LED packaging method for high-power LED lighting fixtures
  • LED packaging method for high-power LED lighting fixtures
  • LED packaging method for high-power LED lighting fixtures

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] 1. Select a thin metal plate or PCB board with uniform thickness as the substrate 1, arrange the copper foil connection circuit 2 on the front of the substrate 1 by bonding and bonding, and spray transparent insulating glue on the surface of the substrate 1 and the connection circuit 2 to form bonding or thermocompression bonding The insulating coating layer 3 constitutes the LED circuit board, and the LED circuit board is provided with holes for accommodating LED light sources in a certain order. The exposed LED connection pad 2 - 1 and the external circuit connection pad 2 - 2 are left beside the position of the insulating film layer 3 covering the connection circuit 2 .

[0036] 2. Solder and connect the pin 4 of the LED light source to the connection circuit 2 on the LED circuit board through the exposed LED connection pad 2-1 next to the insulating coating layer 3 .

[0037] 3. The heat sink 5 is made of a metal material with low thermal resistance, high thermal co...

Embodiment 2

[0039] 1. Select any one of resin material film, rubber material sheet or plastic metal film with uniform thickness with certain bending, twisting and curling properties as the substrate 1, and connect the conductive film connecting circuit 2 to the front of the substrate 1 by bonding 1. Spraying transparent insulating glue on the surface of the substrate 1 and the connection circuit 2 for bonding or thermocompression bonding to form an insulating coating layer 3 to form an LED circuit board. The LED circuit board is provided with LED light source accommodation holes in a certain order. The exposed LED connection pad 2 - 1 and the external circuit connection pad 2 - 2 are left beside the position of the insulating film layer 3 covering the connection circuit 2 .

[0040] 2. Solder and connect the pin 4 of the LED light source to the connection circuit 2 on the LED circuit board through the exposed LED connection pad 2-1 next to the insulating coating layer 3 .

[0041] 3. The ...

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PUM

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Abstract

The invention discloses an LED packaging method for high-power LED lighting fixtures, which comprises the steps: (1) selecting a rigid substrate or a flexible substrate as a substrate, setting a receiving hole of an LED light source on the substrate, and distributing connecting circuits on the surface; (2) covering an insulating film layer on the surface of the substrate (1) distributed with the connecting circuits to form an LED circuit board; (3) performing welding connection on pins of the LED light source and the connecting circuits on the LED circuit board; (4) adhering the LED circuit board to a radiator of a lamp by adopting high temperature resistant strong glue; and (5) ensuring that the LED light source passes through the receiving hole on the LED circuit board and is directly packaged on the surface of the radiator, and adopting a high thermal conductivity bonding material for thermocontact connection between the LED light source and the surface of the radiator. The process method is advanced and simple, has the advantages of novel, reasonable and compact structure, easy production and manufacture, low cost, and convenient use, installation and maintenance, is suitable for the high-power LED lighting fixtures, and is convenient for popularization and application.

Description

technical field [0001] The invention discloses an LED packaging method which is convenient for high-efficiency heat dissipation and is mainly applied to high-power LED lighting lamps, and belongs to the technical field of semiconductor lighting. Background technique [0002] Most of the current LED lighting products are arranged and packaged with multiple LEDs on the whole substrate first, and pre-wired on the substrate to connect the LED light source packaged on it, and then place the substrate on the lamp body Internally connected into the lighting circuit. Therefore, the LED light source is not directly connected to the lamp body, and a layer of substrate is separated between the two. [0003] The LED substrates used in the field of LED lighting are mainly divided into conventional PCB substrates (mainly paper, fiber, resin substrates), ceramic substrates and metal substrates (mainly aluminum alloy substrates) in terms of materials. [0004] High-power LEDs are heat-gen...

Claims

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Application Information

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IPC IPC(8): F21V19/00F21V23/00F21V17/10F21V29/00H01L33/00H01L23/36F21Y101/02F21V29/503F21V29/508F21Y115/10
Inventor 史杰
Owner 史杰
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