A needle tracking inspection device, a detecting device and a needle tracking inspection method

Abstract

The invention provides a needle tracking inspection device, a detecting device with the device and a needle tracking inspection method that can detect protrusion condition of a base layer of an electrode mat to a cardinal plate after detection automatically with high precision, wherein the needle tracking inspection device comprises the following procedures: obtain a R ingredient data (D2), a G ingredient data (D3) and a B ingredient data (D4), then a RGB ingredient obtaining part (50) of the B ingredient data (D4) is selected according to the difference of the reflection index of material quality of an electrode mat (2) and that of a basal layer (6); and to the B ingredient data (D4), in order to obtain image of the basal layer (6) distinguished from the electrode mat (2), a set grey level and a B ingredient histogram obtaining part (52) as relation data having pixels of the grey level, then according to the obtained histogram judge the existence of protrusion of the basal layer (6) in the needle tracking.

Description

technical field [0001] The present invention relates to a stitch inspection device, a stitch inspection method, and a detection device provided with the stitch inspection device, which automatically detect exposure conditions such as the presence or absence of a base layer of electrode pads on a substrate after probe inspection. Background technique [0002] Conventionally, a probe device is used as a device for measuring electrical characteristics of an IC chip formed on a semiconductor substrate. The probing device includes a table on which the substrate is placed and can move freely in three-dimensional directions, and a probe card. A so-called probe test is performed in which the probes of the probe card come into contact with electrode pads that are connected to the wiring on the substrate. Pattern connection, thereby performing electrical measurements of the chip. [0003] Generally, a probe is used as a probe, and an overdrive is applied in order to scrape off the na...

AI Technical Summary

Problems solved by technology

Therefore, in the case of determining the exposed area 111 using existing devices, as Figure 23 shown, from Figure 23 The black and white image of (a) is obtained Figure 23 In the binarized image shown in (b), the shadow 112 and exposed area 111 of cutting chips cannot be distinguished

Therefore, there is a problem that the exposed area 111 is misrecognized as the shadow 112 of the chip, and the chip on which the exposed area 111 is formed is judged to be a good product, or conversely, the shadow 112 of the chip is misidentified as the exposed area. 111. It is determined that the chip that is a qualified product is a defective product, so it is difficult to judge whether an exposed area 111 is formed on the electrode pad 100 by the control unit

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