Laser-stripping method
A technology of laser stripping and isolation area, which is applied in the direction of laser welding equipment, electrical components, circuits, etc., and can solve problems such as damage
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[0022] With regard to the detailed content and technical description of the present invention, examples are now used for further description, but it should be understood that these examples are for illustrative purposes only and should not be construed as limitations to the implementation of the present invention.
[0023] See Figure 5 The present invention is applied to the existing laser lift-off method. In the implementation of the laser lift-off method, an epitaxial layer 200 for luminescence is sequentially formed on a conversion substrate 100 (such as a sapphire substrate). Different from the known laser lift-off method, the present invention etches the epitaxial layer 200 to define an isolation channel 220 around each grain region 210, and there is no etched between two adjacent isolation channels 220, which is also An isolation region 230 of the epitaxial layer 200 material. Therefore, the spacing of the crystal grain region 210 is defined by two adjacent isolation channe...
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