Method for manufacturing holographic mother board by using laser welding imposition

A laser welding and holographic technology, applied in the field of holography, can solve the problems of difficult cutting and splicing precision, large influence of human factors, long imposition cycle, etc., and achieve the effects of small thermal deformation, high cutting precision and high splicing precision

Inactive Publication Date: 2010-01-06
HUBEI XINGLONG PACKAGING MATERIAL
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  • Abstract
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Problems solved by technology

However, due to the softness of the silica gel, it is difficult to control the cutting and splicing accuracy, and the imposition cycle is also very long (because the silica gel replication of each unit holographic pattern generally takes 24 hour

Method used

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  • Method for manufacturing holographic mother board by using laser welding imposition
  • Method for manufacturing holographic mother board by using laser welding imposition

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Example Embodiment

[0024] Example: Using laser welding to make up a large-size holographic master for a cigarette bar box hologram

[0025] Task requirements: The effective molding area of ​​the spliced ​​master is 728×573mm, and the size of each unit holographic pattern (ie cigarette rod box) is 364×286.5mm, a total of 4 unit holographic patterns, forming a 2×2 The matrix of the unit holographic pattern; after adding the frame, the size of the master is 900×700mm.

[0026] The manufacturing method is:

[0027] 1. Copy 4 pieces of the holographic pattern (ie unit holographic pattern) of the cigarette stick box by electroforming, that is, copy 4 pieces of nickel plate with the holographic pattern of the cigarette stick box. The thickness of the nickel plate can be selected about 80 microns (it is more than The electroforming imposition is slightly thicker), but the thickness difference between the nickel plates should be controlled within ±5 microns (the thickness and thickness error can be achieved by...

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Abstract

The invention relates to a method for manufacturing a holographic mother board by using a laser welding imposition, which comprises the following steps: arranging nickel boards of unit holographs according to the requirements, and welding each unit holograph by using the laser energy to manufacture a holographic mother board which has a large dimension and comprises a plurality of unit holographs. The invention has the advantages that the method can be used for splicing unit holographs of arbitrary dimensions and is particularly suitable for splicing unit holographs of large dimensions; the laser welding has the characteristics of fine, smooth and flat welding joints, small thermal deformation and the like and can realize digitally-controlled automatic operation, thus the splicing speed is quick, and the splicing precision is high; and the holographic mother board formed by welding can be electroformed and reproduced into a plurality of mother boards, and the large board formed by laser welding can be also directly arranged on a moulding press for use.

Description

technical field [0001] The invention belongs to the field of holographic technology, in particular to a method for manufacturing a holographic master plate by laser welding imposition. Background technique [0002] At present, the technologies used for imposition at home and abroad can basically be divided into two categories: [0003] The first is a mechanical imposition machine for small-sized unit holograms, which uses the principle of hot stamping to splice small-sized unit holograms into a large-sized hologram master by hot stamping transfer. Due to the limitations of its principle and technology, at present, only small-sized holograms can be spliced, and the unit size is mostly within the range of 10 cm × 10 cm, and large-sized unit holograms cannot be spliced. [0004] The second is the silica gel imposition method. In principle, this method can splice large-sized unit holograms. It uses silica gel to replicate the unit holographic graphics that need to be spliced, ...

Claims

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Application Information

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IPC IPC(8): B41C3/00B41C3/08B23K26/20B23K26/21
Inventor 吴婷婷汤炼
Owner HUBEI XINGLONG PACKAGING MATERIAL
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