Preparation and application of silica gel for LED packaging

A technology of LED encapsulation and organic silicon, which is applied in other chemical processes, chemical instruments and methods, etc., can solve problems such as a long gap, and achieve good transparency, excellent thermal aging ability, and excellent UV aging resistance.

Inactive Publication Date: 2010-01-06
CHENGDU ORGANIC CHEM CO LTD CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the lack of understanding of the emerging industry of LED packaging in China, only a few people are currently engaged in the research and development of such materials.
Mainly through the modification of epoxy resin with silicone materials, its performance has been improved, but compared with foreign products, there is still a long way to go
However, the research on pure silicone materials is still in its infancy, and no similar products have appeared yet.

Method used

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  • Preparation and application of silica gel for LED packaging
  • Preparation and application of silica gel for LED packaging

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0043] The preparation method of component A includes the following steps:

[0044] 1. Pour a certain amount of 500g toluene and 1500g water into a 10L three-necked flask, then weigh 42.3g of methylvinyldichlorosilane monomer, 294g of dimethyldichlorosilane monomer and 0.65g of trimethyl chloride Silane was mixed and dissolved in 500g of toluene, and then the mixed monomer solution was slowly added dropwise at a temperature below 25°C while stirring. Then, it was washed with water until neutral, and water, toluene and unreacted monomers were distilled off under reduced pressure to obtain a prepolymer 1.

[0045] 2. Measure the above-obtained prepolymer 1 into a three-necked flask, then add 178g octamethylcyclotetrasiloxane and 0.3g KOH, carry out catalytic equilibrium at 140-160°C for 6h, cool down, add a small amount of Trimethylchlorosilane is neutralized to neutrality, then the catalyst is removed by filtration, and the unreacted ring body and low boilers are distilled off...

example 2

[0051] The preparation method of component A includes the following steps:

[0052] 1. Pour a certain amount of 500g toluene and 1500g water into a 10L three-necked flask, then weigh 8.5g methylvinyldichlorosilane monomer, 588g dimethyldichlorosilane monomer and 0.74g dimethyldichlorosilane Vinyl chlorosilane was mixed and dissolved in 500 g of toluene, and then the mixed monomer solution was slowly added dropwise while stirring at below 25 ° C. After the dropwise addition, the reactants were measured into a separatory funnel, allowed to stand, layered, and deacidified. The aqueous layer was then washed with water until neutral, and water, toluene and unreacted monomers were distilled off under reduced pressure to obtain prepolymer 1.

[0053] 2. Measure the above-obtained prepolymer 1 into a three-necked flask, then add 0.5 g of KOH, carry out catalytic equilibrium between 140-160 ° C for 6 hours, cool down, add a small amount of trimethylchlorosilane to neutralize to neutral...

example 3

[0059] The preparation method of component A includes the following steps:

[0060] 1. Pour a certain amount of 500g toluene and 1500g water into a 10L three-necked flask, then weigh 127g diphenyldichlorosilane monomer, 294g dimethyldichlorosilane monomer and 1.0g dimethylvinyl Chlorosilane was mixed and dissolved in 500g toluene, and then the mixed monomer solution was slowly added dropwise while stirring at below 25°C. After the dropwise addition, the reactant was measured into a separatory funnel, left standing, layered, and the acid water layer was removed. , and then washed with water until neutral, and distilled under reduced pressure to remove water, toluene and unreacted monomers to obtain prepolymer 1.

[0061] 2. Measure the prepolymer 1 obtained above into a three-necked flask, then 0.5g of KOH, carry out catalytic equilibrium between 140-160°C for 6h, cool down, add a small amount of trimethylchlorosilane to neutralize to neutrality, Then, the catalyst was removed...

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Abstract

The invention relates to preparation of bi-component organic silica gel, which comprises the following steps: firstly, preparing a component A by the co-hydrolysis of vinyl-containing silane and chlorine-containing silane; secondly, preparing a component B by the co-hydrolysis of hydrogen-containing silane and the chlorine-containing silane; and finally, mixing the two components according to certain proportion to obtain a colorless and transparent LED packaging material with heat resistance and low water absorption and without color change under the action of a catalyst C. The material solves the problems of color change, light attenuation and the like caused by poor heat resistance of the conventional thermoplastic packaging materials, plays a role of mechanical support, environment sealing and chip protection to a certain extent, and has good light transmission, adhesiveness, moisture resistance and heat resistance. In addition, the hardness, the adhesion and the heat resistance of the material can be regulated according to the demand of application. The material not only is suitable for LED packaging, but also can be applied to the fields of optical lenses, solar cell substrates, touch screens and the like.

Description

technical field [0001] The invention belongs to the application field of optoelectronic technology, and relates to the preparation and application of a silica gel material for LED packaging with strong transparency and good heat resistance. Background technique [0002] LED is the abbreviation of light emitting diode in English. It is an electroluminescent light source and a semiconductor device that directly converts electrical energy into light energy. It is mainly composed of PN junction chips, electrodes, optical systems, packaging materials and accessories. . Its core part is a wafer composed of p-type semiconductors and n-type semiconductors, and there is a transition layer between p-type semiconductors and n-type semiconductors, called p-n junction. In the PN junction of some semiconductor materials, when the injected minority carriers recombine with the majority carriers, the excess energy is released in the form of light, thereby directly converting electrical ener...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/05C09K3/10
Inventor 刘白玲张保坦陈华林侯晓辉杜翠鸣杜谭欣
Owner CHENGDU ORGANIC CHEM CO LTD CHINESE ACAD OF SCI
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