Method for manufacturing resin casting mold type electronic component

Abstract

The present invention provides a method for manufacturing a resin casting mold type electronic component, which can avoid the casting mold resin being peeled from a main substrate, and can ensure to manufacture the high-reliability resin casting mold type electronic component efficiently in a working procedure for manufacturing the resin casting mold type electronic component. The main substrate (1a) for loading components comprises: an effective zone (11) for forming a composition part of a plurality of resin casting mold type electronic components (30) after separation; and a perimeter zone(12) for no forming the composition part of the resin casting mold type electronic components outside the effective zone. The effective zone is loaded with a surface assembling component (3), an anchor pile part (20) is formed on the perimeter zone for providing the casting mold resin (31) to the main substrate (1a), a loading surface of the surface assembling component is sealed by the casting mold resin, and the anchor pile part (20) combines the casting mold resin (31) with the main substrate (1) assuredly. A concave part and / or a convex part, a through-hole or a matched structure form on the perimeter zone of the main substrate as the anchor pile part. A solder structure, a resin structure and the surface assembling component are used as the structure.

Description

technical field [0001] The present invention relates to a method of manufacturing electronic parts, and more particularly to a method of manufacturing resin molded electronic parts having a structure in which surface mount parts are mounted on a substrate and the mounting surface of the surface mount parts is covered with molding resin. Background technique [0002] Such as Figure 7 As shown, for example, in an electronic part, the bare chip (surface mount component) 52 is first loaded on the circuit substrate 51, and the ball grid array 56 is configured on the lower surface of the circuit substrate 51 as an external circuit connection terminal member; The leads 53 drawn from the bare chip 52 are soldered to the bonding pattern 57 on the upper surface of the circuit board 51; then, the surface on which the bare chip 52 is mounted is covered with a molding resin 54, thereby imparting weather resistance and impact resistance. Such a resin molded electronic component (in this ...

AI Technical Summary

Problems solved by technology

However, the actual situation is that in the state where the mold resin has been cured, the hardness of the resin is very high, and it is not easy to perform grinding or half-cutting.

[0011] Therefore, it is considered that the above-mentioned grinding process or half-cutting process is performed in a semi-cured state, that is, in a state where the casting resin is cured to the extent that it has not yet reached the final cured state, but the tight bonding of the casting resin to the main substrate in the semi-cured state is considered. Most of the strength is not so strong, and the molding resin will peel off from the main substrate (especially in the peripheral area of ​​the main substrate, it is easy to peel off)

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