Die Forging Process and Die of High Silicon Aluminum Alloy Swash Plate

A high-silicon aluminum alloy, die forging technology, applied in the direction of manufacturing tools, metal processing equipment, forging/pressing/hammer devices, etc., can solve problems such as poor plastic forming performance, improve plastic forming performance, simplify mold structure and manufacturing , the effect of fine primary silicon particles

Inactive Publication Date: 2011-12-28
冯福贵 +2
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Problems solved by technology

[0006] The invention provides a high-silicon aluminum alloy swash plate die forging process and mold, that is, the aluminum alloy swash plate part die forging process, and provides a die for realizing the die forging process, the purpose of which is to effectively overcome the problems existing in the high-silicon aluminum alloy during die-casting The problem of poor plastic formability

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  • Die Forging Process and Die of High Silicon Aluminum Alloy Swash Plate
  • Die Forging Process and Die of High Silicon Aluminum Alloy Swash Plate
  • Die Forging Process and Die of High Silicon Aluminum Alloy Swash Plate

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[0026] Such as figure 1 , figure 2 , image 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 shown.

[0027] The high-silicon aluminum alloy described in the present invention refers to the high-silicon aluminum alloy with the brand name: A390. The Si element content in the A390 aluminum alloy is 16-18%. Silicon alloy material, the alloy has good wear resistance, corrosion resistance, low thermal expansion coefficient and high air tightness, and is suitable for manufacturing swash plate parts; there is no specific brand corresponding to it in China.

[0028] High-silicon aluminum alloy swash plate die forging process, the process flow is: A390 extruded bar material→cutting→heating→forging plastic forming→subsequent processing, the blank is accurately blanked according to the principle of equal volume, and the heating temperature of the blank is 500℃± 5°C, the preheating temperature of the die is 200°C±5°C, and the small flash die forging process directly die-forges th...

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Abstract

High-silicon aluminum alloy swash plate die forging process, the plastic forming of the die forging is realized by the small flash open forging die. The heating temperature is 500°C±5°C, the die preheating temperature is 200°C±5°C, and the small flash die forging process directly die-forges the heated aluminum alloy bar into a swash plate die forging with small flash. The die is an open forging die with small flash, which is composed of an upper punch, a lower punch and an extrusion cylinder. The die adopts a separable structure. 3mm, thickness of 0.5mm ring-shaped uniform gap, that is, the flash groove, the draft angle of all surfaces in contact with the extrusion cylinder is less than or equal to 5 degrees, the process flow of the invention is reasonable, the process parameters and performance are stable, the mold structure is simple, It is easy to manufacture, install and use, and works reliably.

Description

technical field [0001] The invention relates to a high-silicon aluminum alloy swash plate die forging process and mold, which can be directly used in the die forging production of key parts such as automobiles, airplanes and household air-conditioning compressors, which use high-silicon aluminum alloy as materials, and belong to the plastic forming of metal materials Field with mold technology. Background technique [0002] The swash plate is a key part of the air-conditioning compressor. It drives the piston to reciprocate and work back and forth under high-speed rotation, and the frequency is extremely high. Therefore, the material is required to have the characteristics of high strength, high hardness and good wear resistance. Generally, aluminum-silicon series cast aluminum is used. alloy. [0003] The content of Si element in A390 aluminum alloy is 16-18%. It is a high-silicon aluminum alloy. It is an American brand of hypereutectic casting aluminum-silicon alloy mater...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B21J5/02B21J1/06B21J13/02B21K1/32
Inventor 冯福贵邓磊胡国安王新云夏巨谌
Owner 冯福贵
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