Welding method of target materials and back plates
A welding method and a technology of a back plate, which are applied in the direction of welding medium, welding equipment, welding/welding/cutting items, etc., can solve problems such as easy oxidation of copper targets and affect the welding effect of target components, so as to improve the bonding strength of brazing , Improve the effect of infiltration and fusion
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0041] The following are the process steps and welding results for brazing a 99.9999% high-purity Cu target and 6061Al alloy backplane:
[0042] (1) Forming a metal intermediate layer on the surface of the target: Plasma spraying technology is used to form a metal intermediate layer on the welding side of the Cu target. Specifically, a plasma arc driven by a direct current is used as a heat source to easily convert Cu or Ni-Cr alloys. The material infiltrated with the brazing filler metal is heated to a molten or semi-molten state, and sprayed on the surface of the pretreated Cu billet at a high speed to form a firmly attached metal layer with a thickness of 400um.
[0043] (2) Surface processing of the target and back plate: the Cu target surface and the surface of the 6061Al alloy back plate are machined to make them bright, and the smoothness reaches 0.2um to 1.6um.
[0044] (3) Chemical cleaning of targets and backplanes: the Cu target is first cleaned with acid solution and then...
Embodiment 2
[0053] The following are the process steps and welding results of brazing 99.9999% high purity Cu target and ZL105 aluminum alloy backplane:
[0054] (1) Forming a metal intermediate layer on the surface of the target: Plasma spraying technology is used to form a metal intermediate layer on the welding side of the Cu target. Specifically, a plasma arc driven by a direct current is used as a heat source to easily convert Cu or Ni-Cr alloys. The material infiltrated with the brazing filler metal is heated to a molten or semi-molten state, and sprayed at a high speed to the surface of the pretreated Cu billet to form a firmly attached metal layer with a thickness of 200um.
[0055] (2) Surface processing of the target and backplane: The surface of the Cu target and the surface of the ZL105 aluminum alloy backplane are machined to make them bright, and the finish can reach 0.2um to 1.6um.
[0056] (3) Chemical cleaning of the target and backplane: first clean the Cu target with acid solu...
Embodiment 3
[0065] The following are the process steps and results of brazing 99.9999% high-purity Cu target and brass backing plate:
[0066] (1) Forming a metal intermediate layer on the surface of the target: Plasma spraying technology is used to form a metal intermediate layer on the welding side of the Cu target. Specifically, a plasma arc driven by a direct current is used as a heat source to easily convert Cu or Ni-Cr alloys. The material infiltrated with the brazing filler metal is heated to a molten or semi-molten state, and sprayed at a high speed to the surface of the pretreated Cu billet to form a firmly attached metal layer with a thickness of 200um.
[0067] (2) Surface processing of the target and back plate: The surface of the Cu target and the surface of the brass back plate are machined to make them bright, and the finish can reach 0.2um to 3.2um.
[0068] (3) Chemical cleaning of the target and back plate: the Cu target is cleaned with acid solution first, and then with organi...
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com