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Working device, adhesive tape applying device, and method of adding tape member

A technology of laminating device and joining device, applied in the directions of adhesives, electrical components, sending objects, etc., can solve the problems of transportation failure, increased burden, complicated device structure, etc., achieve smooth belt transfer, reduce management burden, and simple device structure. Effect

Active Publication Date: 2010-02-17
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, as described in Patent Document 1, in the method of thermocompression-bonding the ACFs, the ACF layer may protrude from the parting tape, and the protruding adhesive ACF may adhere to the rollers in the subsequent tape conveyance path. The problem of transportation failure caused by other components
[0008] In addition, in the case of using an adhesive tape, which is a separate member from the ACF tape, there is a problem that the structure of the device is complicated for attaching the adhesive tape.
Furthermore, since the adhesive tape and the ACF tape are independent members, there is also a problem of increasing the burden for managing such an adhesive tape.

Method used

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  • Working device, adhesive tape applying device, and method of adding tape member
  • Working device, adhesive tape applying device, and method of adding tape member
  • Working device, adhesive tape applying device, and method of adding tape member

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0086] figure 1 It is a schematic perspective view which shows the structure of the ACF bonding apparatus 100 which is an example of the adhesive tape bonding apparatus with a release tape concerning 1st Embodiment of this invention. also, figure 2 A schematic plan view showing the ACF bonding apparatus 100, image 3 Indicates a schematic side view. Figure 1 ~ Figure 3The ACF bonding apparatus 100 shown is an ACF tape (tape member) that is bonded to one side of a parting tape using ACF (Anisotropic Conductive Film) as an example of an adhesive tape. ACF is bonded to a substrate (hereinafter referred to as "panel substrate"), and the ACF release tape is peeled off to form a device in a state where components can be mounted on a panel via the bonded ACF. Moreover, in the present embodiment, an ACF containing anisotropic conductive particles is used as an example of an adhesive tape for description, but it is also possible to use a tape that does not contain anisotropic con...

no. 2 Embodiment approach

[0114] In addition, the present invention is not limited to the above-described embodiments, and may be implemented in various other forms. E.g, Figure 14 The schematic diagram of : shows the apparatus structure for performing bonding process in the ACF bonding apparatus of 2nd Embodiment of this invention.

[0115] like Figure 14 As shown, in the ACF bonding apparatus of the second embodiment, although the bonding device 40 (for example, a wedge-shaped protruding tool 73 is attached) is provided as the same bonding device 40 as that of the first embodiment, other than that, in the bonding device 40 An ACF discarding device 80 is provided adjacent to the downstream side in the belt conveyance direction.

[0116] The ACF discarding device 80 is to use its adhesiveness to bond the ACF3 to be removed in the ACF tape 1, thereby peeling and removing it from the release tape 2, and performing the so-called "discarding ( て打ち) processing" device. Furthermore, the ACF discarding...

no. 3 Embodiment approach

[0125] Figure 16 It is a schematic diagram which shows the partial structure of the ACF bonding apparatus 110 which concerns on 3rd Embodiment of this invention. like Figure 16 As shown, the ACF bonding apparatus 110 of the third embodiment has a structure in which, in the bonding apparatus 120, the arrangement of the heating unit 122 and the table 121 is reversed with respect to the conveyance path of the ACF tape.

[0126] Specifically, as Figure 16 As shown, a table 121 is disposed between the cutter 34 and the ACF discarding device 80 . Furthermore, the heating unit 122 is arranged so as to face the table 121 across the conveyance path of the ACF tape. The heating unit 122 is arranged on the left side of the head 21 of the crimping head unit 20 in the drawing, and is movable so as to approach the table 121 during pressurization and heating operations for bonding processing. Furthermore, the heating unit 122 includes a protruding tool 123 and a heater 124 . In addit...

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Abstract

In adhesive tape application operation, a tape member formed by bonding an adhesive tape to one side of a release tape is conveyed along a tape conveyance route, the adhesive tape is cut to a predetermined length, and the adhesive tape is released from the release tape and applied to a substrate. The trailing part of a first tape being used in an adhesive tape applying device and the leading partof a second tape to be added are placed superposed on each other. The overlapped region of the leading and trailing parts of the first and second tapes is heated while being partially pressed at leastin the direction of the width of the tapes. As a result, the first and second tapes are fused and bonded in the overlapped region.

Description

technical field [0001] The present invention relates to an operation device for attaching components to an object such as a display panel typified by a liquid crystal panel or a PDP (Plasma Display Panel), and particularly relates to bonding of an adhesive tape for attaching and fixing the mounted components With fitting device. Moreover, it is related with the addition method of the tape member which joins and adds the edge part of the tape member to which the adhesive tape continuous in the longitudinal direction was pasted together in such an adhesive tape bonding apparatus. Background technique [0002] Conventionally, there is known a component mounting apparatus that sticks an adhesive tape for fixing a mounting component to a display panel such as a liquid crystal panel, and press-bonds the mounting component to the adhesive tape. For example, there is a component mounting device that uses an ACF tape with ACF attached to one side of the release tape, attaches the AC...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65H19/18B65H21/00
CPCB65H2301/4634B29C66/21B29K2995/0044B29K2995/0005B29C65/22B29C65/222B29C66/723B65H2301/46412H05K3/323B29C2793/00B29C65/5092B29C65/08B29C65/4815B65H2801/61B29C65/18B29L2009/00B29C65/305B29C66/306B29C66/1122B29C65/7847B29C65/02B29C66/43B65H19/1852B29C65/5021B29C65/5042B65H2301/4621B65H2701/377B29C66/1142B29C66/83221B29C66/71Y10T156/12B29C66/853B29C66/81429B29K2067/003B65H35/06B65H19/18B65H21/00
Inventor 片山敦村田裕幸伊田雅之小田原广造
Owner PANASONIC CORP
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