Circuit board introducing device of solder-reflow furnace

A technology of reflow soldering furnace and importing device, which is applied in the direction of auxiliary devices, electrical components assembling printed circuits, welding equipment, etc., which can solve the problems of board climbing, board dropping, board jamming, etc., achieve stable performance and reduce board dropping , Fast and convenient installation and disassembly

Inactive Publication Date: 2010-02-24
依工电子设备(苏州)有限公司
View PDF0 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a circuit board importing device for a reflow oven, which solves the problems in the prior art that the circuit boards in the reflow oven are prone to climb, drop and jam when the circuit board is transported and introduced.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Circuit board introducing device of solder-reflow furnace
  • Circuit board introducing device of solder-reflow furnace
  • Circuit board introducing device of solder-reflow furnace

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0030] The above solution will be further described below in conjunction with specific embodiments. It should be understood that these embodiments are used to illustrate the present invention and not to limit the scope of the present invention. The implementation conditions adopted in the examples can be further adjusted according to the conditions of specific manufacturers, and implementation conditions not specified are usually conditions in routine experiments.

[0031] Implementation example Figure 1~5 , The circuit board introduction device of the reflow soldering furnace, the reflow soldering furnace includes a fixed guide rail 2 fixed on the furnace body bracket 1 at both ends, a conveying chain 3 is arranged in the inner extension of the fixed guide rail 2, and the conveying chain is outside Engaging the sprocket gear driven by the power unit, the front end of the conveyor chain 3 at the entrance of the reflow oven is provided with an introduction block 4, and the intro...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a circuit board introducing device of a solder-reflow furnace comprising a fixed guide rail (2) fixed to a furnace body brackets (1) at two ends. A conveying chain (3) is arranged in an extending section at the inner side of the fixed guide rail (2). The circuit board introducing device of the solder-reflow furnace is characterized in that an introducing block (4) is arranged at the front end of the conveying chain (3) at the entry of the solder-reflow furnace and provided with a horizontal guide block (41) approaching the upper end of the conveying chain (3). The device is applied to the front end of the conveying chain of the solder-reflow furnace, greatly improves the conveying stability of printed circuit boards and reduces the phenomena of dropping, clamping and climbing of the circuit boards.

Description

Technical field [0001] The invention belongs to the technical field of circuit board transportation design of a reflow soldering furnace, and in particular relates to a circuit board introduction device of a reflow soldering furnace that prevents board climbing and board drop. Background technique [0002] Surface mount technology has been widely adopted in recent years, and it is not difficult to find electronic products that use surface mount technology in daily life. Such as frequently used mobile phones, notebook computers, calculators, pagers, etc., can not leave the surface mount technology. The surface mount technology has advantages that the traditional plug-in technology can't compare: miniaturization: the volume of the traditional perforated component can no longer be reduced. Compared with perforated components, the volume of surface mount components is greatly reduced by many times, making electronic products more miniaturized. Large-scale, highly integrated electro...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/008B23K3/08H05K3/34
Inventor 尚严辉王传波
Owner 依工电子设备(苏州)有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap