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Semiconductor manufacturing system, processing system, interface system, container, carrier, and adsorption plant

An interface and mechanical system technology, used in semiconductor/solid-state device manufacturing, thin material handling, transportation and packaging to improve manufacturing efficiency and product quality

Active Publication Date: 2011-07-20
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

An environmentally controlled tank and air circulation system coupled to the encapsulation chamber

Method used

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  • Semiconductor manufacturing system, processing system, interface system, container, carrier, and adsorption plant
  • Semiconductor manufacturing system, processing system, interface system, container, carrier, and adsorption plant
  • Semiconductor manufacturing system, processing system, interface system, container, carrier, and adsorption plant

Examples

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Embodiment Construction

[0040] The following description provides many different embodiments for applying the different features of the invention. The invention will be briefly described with specific examples of components and arrangements. These are examples only and not limitations. In addition, this specification reuses reference numerals and characters in various instances. These repetitions are for simple and clear description, and do not indicate the relationship between multiple embodiments. The so-called connection or coupling here means direct contact, and may also be indirect contact. In addition, the relative description words in space, such as "bottom", "upper", "horizontal", "vertical", "high", "low", "top" and "bottom" are just to explain the relative relationship between components, so other different Targeted devices are also included in their examples.

[0041] refer to Figure 1 to Figure 6 , a semiconductor manufacturing system 100 , an interface system 300 , a carrier 400 , ...

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PUM

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Abstract

The invention relates to a semiconductor manufacturing system, a processing system, an interface system, a container, a carrier, and an adsorption plant. In an embodiment of the interface system, a packaging chamber and at least one gate covering an opening of the packaging chamber are provided. A mechanical system is arranged in the packaging chamber, comprising at least one bracket for supporting and sending at least one base plate. At least a first tube is coupled in the packaging chamber and gas is injected in the packaging chamber. An environment controlling groove and an air circulationsystem are coupled in the packaging chamber. The invention can ensure that chip is not exposed in harmful environment any more, to promote the manufacturing efficiency of chip and product quality.

Description

technical field [0001] The present invention relates to the field of semiconductor manufacturing systems, and more particularly to semiconductor manufacturing systems that provide a controlled environment. Background technique [0002] Integrated circuit technology continues to evolve, and these evolutions make devices smaller and smaller, thereby achieving low manufacturing costs, high device integration density, high speed, and high performance. With the advantages of shrinking size, the mechanisms for manufacturing and producing integrated circuits have evolved. [0003] Semiconductor integrated circuits are made through multiple processing steps in an integrated circuit fabrication plant. The fabrication tools involved in these processes include thermal oxidation, doping, ion implantation, rapid thermal processing (RTP), chemical vapor deposition (CVD), physical vapor deposition (PVD), epitaxy, etching, and optical etching techniques. During the manufacturing process, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00H01L21/683H01L21/673
CPCH01L21/67772Y10S414/135H01L21/67017
Inventor 萧义理余振华汪青蓉何明哲黄见翎洪瑞斌
Owner TAIWAN SEMICON MFG CO LTD