Resist composition for immersion exposure and method for manufacturing a semiconductor device using the same
A resist and composition technology, applied in the field of semiconductor device production, can solve problems such as undeveloped, few material components, and stripes on the surface of the resist film
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Embodiment 1
[0165] Preparation of liquid immersion exposure resist composition
[0166] Base resins (acrylic resins) (a) to (c) are represented by structural formulas (7) to (9), silicon-containing side chain resins 1 to 4 are represented by structural formulas 3 to 6 in Synthesis 1 to 4, and the above two resins Use as indicated in Table 1. Then, with respect to 100 parts by weight of the base resin, 3 parts by weight of triphenylsulfonium nonafluorobutanesulfonate (triphenylsulfonium nonafluorobutanesulfonate) (manufactured by Midori Kagaku Co.) as an acid generator, and 900 parts by weight of propylene glycol monomethyl Ether acetate (PGMEA) was used as a solvent, thereby preparing immersion exposure resist compositions A to R.
[0167] Base resin (a) (weight average molecular weight (Mw) = 15,600)
[0168]
[0169] Structural formula (7)
[0170] Base resin (b) (weight average molecular weight (Mw) = 9,600)
[0171]
[0172] Structural formula (8)
[0173] Base resin (c) (w...
Embodiment 2
[0180] Assess hydrophobicity
[0181] The immersion exposure resist compositions A to R shown in Table 1 were applied by a spin coating method at 1,500 rpm for 20 seconds to a surface coated with an antireflective film (ARC-39 manufactured by Nissan Chemical Industries Plant). on the substrate. The substrate was baked on a hot plate at a temperature of 110° C. for 60 seconds, and then a resist film with a thickness of 250 nm was formed. The static contact angle and receding contact angle (dynamic contact angle) of pure water and each resist film were measured and compared.
[0182] The static contact angle was measured by a contact angle meter (CA-W 150, manufactured by Kyowa Interface Science Co., Ltd.) at an ejection time of 40 ms.
[0183] For the measurement of the receding contact angle, the substrate with the resist film is fixed on an inclined platform whose angle can be continuously changed by self-made equipment, and then a drop of pure water (50 μl) is dropped on t...
Embodiment 3
[0189] Evaluation of corrosion resistance
[0190] The liquid immersion exposure resist compositions K to M, D, H, I, and J shown in Table 1 were all applied by the spin coating method at 1,500 rpm for 20 seconds onto a surface using an antireflection film (manufactured by Nissan Chemical Industries factory). fabricated on ARC-39) coated substrates. The substrate was baked on a hot plate at a temperature of 110° C. for 60 seconds, and then a resist film with a thickness of 250 nm was formed.
[0191] Next, the space between the resist film and the optical elements of the liquid immersion exposure apparatus was filled with water, and then, the resist film was exposed to ArF excimer laser light (wavelength: 193 nm).
[0192] The obtained resist film was developed using a 2.38 wt % TMAH aqueous solution to remove the irradiated regions of the resist film. Thus, a 200 nm line / space pattern was developed with exposure amounts as shown in Table 3.
[0193] table 3
[0194] ...
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