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Laminated wiring board and method for manufacturing the same

A technology for wiring substrates and manufacturing methods, which is applied in the directions of multilayer circuit manufacturing, printed circuit manufacturing, and electrical connection formation of printed components, which can solve problems such as unevenness, roughening of conductive layers, and complicated manufacturing, and reduce the number of processes , high connection reliability, simple and easy to manufacture

Active Publication Date: 2010-03-24
THE FUJIKURA CABLE WORKS LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Similar to the above-mentioned second example, this technology brings about the problem of roughening of the conductive layer due to unevenness. In addition, it is necessary to control the surface roughness and uneven shape with high precision when actively roughening the surface.
Therefore, for these reasons, its manufacture is complicated

Method used

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  • Laminated wiring board and method for manufacturing the same
  • Laminated wiring board and method for manufacturing the same
  • Laminated wiring board and method for manufacturing the same

Examples

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Effect test

Embodiment Construction

[0030] Below, refer to figure 1 and figure 2 One embodiment of the laminated wiring board of the present invention and its manufacturing method will be described. figure 1 It is a schematic cross-sectional view for explaining a method of laminating a plurality of wiring board base materials to manufacture a laminated wiring board. figure 1 (a) shows each wiring board base material before assembly. figure 1 (b) shows the structure of the assembled laminated wiring board. figure 2 (a)~ figure 2 (g) is used for step-by-step instructions figure 1 An enlarged cross-sectional view of a main part of the manufacturing method of each wiring board base material in .

[0031] First, if figure 1 As shown in (a), first to fourth wiring board base materials 1 to 4 adjacent to each other in the vertical direction are arranged so as to overlap each other. The above-mentioned first wiring board base material 1 has, for example, a first insulating substrate 1a made of a polyamid...

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Abstract

Wiring board bases (2-4) are provided with insulating substrates (1a-4a) having conductive layers (1b-4b) on the surfaces on one side, respectively; through holes (2e-4e) which are arranged on the insulating substrates and reach the conductive layers from the other surfaces; and conductive vias (2d-4d) connected to the conductive layers by filling the through holes with a conductive paste. In a method for manufacturing a laminated wiring board, at least one of the wiring board bases is laminated. Before the through hole is filled with the conductive paste, a surface portion in the through holeon the conductive layer is smoothed and a smooth surface section (2g) is formed.

Description

technical field [0001] The present invention relates to a laminated wiring board and a manufacturing method thereof, and more particularly to a laminated wiring board capable of obtaining high connection reliability between interlayer conductive columns and wiring conductive layers in a multilayer wiring board, and to a laminated wiring board and its method. Manufacturing method. Background technique [0002] In recent years, along with the increase in the miniaturization and multi-function requirements of mobile phones and various digital electronic devices, there is also a further strong demand for the miniaturization of electronic components such as semiconductor IC elements used in these devices and printed wiring boards on which such components are mounted. and multifunctional. Based on such demands, various multilayer wiring board technologies have been developed. [0003] As the first example of conventional multilayer wiring board technology, there is EWLP (Embedde...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46H05K1/11H05K3/40
CPCH01L2224/83191H01L2924/0665H05K3/386H01L2224/2919H05K3/4617H05K3/4069H05K2203/0392H01L2924/01322H05K2203/0346H01L2924/01006H05K3/4602H05K2203/0191H05K3/382H05K3/0035H05K2201/0394Y10T29/49165Y10T29/49155Y10T29/49126H01L2924/00H05K3/46
Inventor 本户孝治
Owner THE FUJIKURA CABLE WORKS LTD
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