A method for etching copper and recovery of the spent etching solution
A recycling method, a technology for etching solutions, applied in chemical instruments and methods, separation methods, removal of conductive materials by chemical/electrolytic methods, etc., can solve problems such as economic and environmental burdens
Active Publication Date: 2012-07-25
SIGMA ENG AS
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Problems solved by technology
[0004] In conventional etching using an acid etching solution, the consumed etching solution must be disposed of, becoming an economical and environmental burden
Method used
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[0080] has been tested in industry as figure 1 The etch process combined with the recovery process shown in the flow diagram of , where hydrogen peroxide is used as the oxidizing agent. The experimental results are shown in the following examples. The used etching solution 7 removed from the etching step had the following composition:
[0081]
[0082] The etching solution 7 is pumped from the buffer tank 6 into a mixing and settling device having a first extraction step 8 , a second extraction step 13 and a stripping step 14 . The flow rate of the etching solution was 0.4 l / min.
[0083] In a first extraction step 8, the used etching solution 7 is brought into contact with an organic solution 9 containing 30% by volume of hydroxyxime, 65% by volume of a solvent containing essentially aliphatic hydrocarbons and 5% by volume of a solvent containing Solvent for aromatic hydrocarbons. The flow rate of the organic solution was 1.2 l / min. At this point, copper was extracted...
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An etching and recovery method is described, wherein articles made of copper are etched with an acid aqueous solution of etching chemicals containing Cu2+ for oxidising Cu0 to Cu+, chloride ions, oxidising agent which oxidises Cu+ to Cu2+, and pH-adjusting hydrochloric acid. The technical problem to be solved is to make it possible to circulate the etching solution between the etching process andthe recovery process during the recovery of used etching solution in such a manner that a closed circuit can be maintained between the processes. This is effected in that a regenerated etching solution containing a lower quantity of Cu2+ than the used etching solution is produced and in that the recovery process has an extraction step in which removed etching solution is mixed with an organic extraction solution of a complexing compound with which Cu2+ forms a copper complex which can be extracted in the organic extraction solution, after which the two mixed liquids are separated once again in order to obtain an organic extraction solution containing said copper complex, and regenerated etching solution. The method is carried out with an etching solution having a pH above 1.5 and a high copper content.
Description
technical field [0001] The present invention relates to etching and recovery methods comprising an etching process having at least one etching step in which an article having an exposed surface of metallic copper is etched using an aqueous acid etching solution containing an etching chemical, wherein in The supply of the etching chemical solution during the etching process is accompanied by the removal of an equal volume of etching solution, the etching chemical comprising divalent copper ions, chloride ions for oxidizing metallic copper to monovalent copper ions , an oxidizing agent for oxidizing the monovalent copper ions to divalent copper ions, hydrochloric acid as a pH adjusting acid and an aqueous solution, the aqueous solution contains copper ions and is removed as needed when the copper ion content of the working etching solution exceeds a predetermined range Added to the working etching solution, the copper ion content of the aqueous solution is lower than the predete...
Claims
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IPC IPC(8): C23F1/46B01D11/04H05K3/06
CPCB01D11/0457C23F1/46C23F1/18H05K3/068B01D11/04H05K3/06H05K3/067
Inventor 哈拉尔德·奥特图思
Owner SIGMA ENG AS