Manufacture method of low-attenuation white light LED
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A production method and low-attenuation technology, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of high cost, complex process, light attenuation and product reliability decline, and achieve low reflectivity, simple operation process, and light less attenuation effect
Inactive Publication Date: 2010-04-14
中外合资江苏稳润光电有限公司
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However, this method is complicated in process and high in cost, and still fails to solve the problems of light attenuation and product reliability degradation caused by the gap between silicone and epoxy resin
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Embodiment 1
[0027] 1) Fix the blue chip 2 in the base of the bracket 1, and weld the gold wire 3;
[0028] 2) Add the oxides of Ca, Mg, Ti, Si, Zr, Gd elements to the main agent of silica gel, the weight of the oxide accounts for 1% of the weight of the main agent of silica gel, and the particle size is 3-10um, and stir evenly;
[0029] 3) Mix the stirred silicone main agent with the curing agent and stir evenly;
[0030] 4) Add yellow fluorescent powder to the silica gel containing two components of silica gel main agent and curing agent, the weight of the yellow fluorescent powder accounts for 5% of the weight of the silica gel, and stir evenly;
[0031] 5) Coating the stirred silica gel mixture on the blue chip 2 to form the first coating layer 5, the first coating layer 5 should completely encapsulate the blue chip 2;
[0032] 6) Baking and curing the first coating layer 5, the baking temperature is 120°C-150°C, and the baking time is 1-2 hours;
[0033] 7) Add the oxides of Ca, Mg,...
Embodiment 2
[0037] The production method of this embodiment is basically the same as that of Embodiment 1, the difference is that in steps 2), 4), and 7), the weight percentages of oxide and yellow phosphor are respectively 3%, 7%, and 4%, and then Make adjustments.
Embodiment 3
[0039] The production method of this embodiment is basically the same as that of Embodiment 1, the difference is that in steps 2), 4), and 7), the weight percentages of oxide and yellow phosphor are respectively 5%, 10%, and 5%, and then Make adjustments.
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Abstract
The invention discloses a manufacture method of a low-attenuation white light LED, which comprises the following steps of (1), fixing a blue wafer in a base of a bracket, welding a line; (2), firstly adding inorganic filler in a main agent of silicon gel, uniformly stirring, then adding a curing agent to be uniformly mixed with the inorganic filler; (3), adding yellow fluorescent powder in the silicon gel containing two components, uniformly stirring and coating on the blue wafer to form a first coating layer, baking and curing;(4), adding a nano inorganic filler in a mixture of the silicon gel and epoxy glue, uniformly stirring, coating on the first coating layer to form a second coating layer, baking and curing; and (5), packing the periphery of the base by using the epoxy glue. A stress buffer layer is additionally arranged between the first coating layer and the externally packed epoxy glue, thereby changing the refraction angle of the light, reducing the reflection ratio of the light and the attenuation of the light, improving the light extraction efficiency of the white light LED, greatly improving the attenuation property of the product and ensuring the reliability of the product.
Description
technical field [0001] The invention relates to a method for manufacturing a white light LED, in particular to a method for manufacturing a low-attenuation white light LED, and belongs to the field of optoelectronic technology. Background technique [0002] LED light-emitting diode is a solid-state semiconductor device that can directly convert electricity into light. As a light source, white LED has the characteristics of high luminous efficiency, short life, strong applicability, and no pollution to the environment. It is gradually being used in lighting, traffic lights, car signal lights, background light sources and other fields. Existing white light LEDs generally use silica gel mixed with yellow fluorescent powder to coat the blue chip, and then encapsulate the periphery with epoxy resin glue. This method can improve the high temperature resistance and UV resistance of the LED, but because there is a gap between the silica gel and the outer sealing epoxy resin, on thi...
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