Method for packaging SMT crystal resonator/oscillator by epoxy resin mold

A technology of crystal resonator and epoxy resin, applied in the direction of electrical components, impedance network, etc., can solve the problem of low yield, achieve the effect of improving yield and preventing cracking

Inactive Publication Date: 2010-06-02
WUHAN WINNINGCHINA MICROSYST TECH
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0004] The technical problem to be solved by the present invention is to solve the problem that the yield rate is low when epoxy resin molding is used to encapsulate SMT crystal resonators or oscillators

Method used

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  • Method for packaging SMT crystal resonator/oscillator by epoxy resin mold
  • Method for packaging SMT crystal resonator/oscillator by epoxy resin mold
  • Method for packaging SMT crystal resonator/oscillator by epoxy resin mold

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Embodiment Construction

[0019] The present invention will be described in detail below in conjunction with the accompanying drawings.

[0020] see Figure 6 , Figure 7 , the present invention comprises the following steps:

[0021] A10, the welding spot on the crystal resonator or the oscillator base 2 is integrated with the substrate 7 through solder 8, and the thickness of the solder 8 is less than 40 microns;

[0022] A20. Place the crystal resonator or oscillator with the substrate welded between the upper mold 10 and the lower mold 11, pressurize and pour 160°C to 180°C thermosolid epoxy resin into the mold cavity 9 through the sprue port 12, The perfusion pressure is 2MPa-4Mpa, and the epoxy resin is mixed with spherical silicon particles with a diameter of 13-75 microns;

[0023] A30. After 90 seconds of curing time, demould to obtain an SMT crystal resonator or oscillator, Figure 7 Among them, 4 is the quartz plate inside the crystal resonator or the oscillator, 6 is the metal shell of ...

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Abstract

The invention discloses a method for packaging an SMT crystal resonator/oscillator by an epoxy resin. The method comprises the following steps of: A10, welding welding-points on a base of a crystal resonator/oscillator with a base plate into a whole body by solders with the thickness less than 40 microns; A20, placing the crystal resonator/oscillator welded with the base plate in a mold, pouring thermosetting epoxy resin with the temperature of 160-180 DEG C in a mold cavity under the pressure of 2-4 Mpa, wherein the thermosetting epoxy resin is doped with spherical silicon granules with the diameter of 13-75 microns; and A30, after passing the curing time of 90 seconds, de-molding to obtain the SMT crystal resonator/oscillator. The invention can efficiently prevent materials of plastic package from flowing into intervals between the base of the crystal resonator/oscillator and the base plate such that the pressure of injection molding does not act on the base of the crystal resonator/oscillator; therefore, the cracking of the base of the crystal resonator/oscillator is prevented, the finished product ratio is improved, and effective guarantee is provided for the batch production of the plastic package of the crystal resonator/oscillator mold.

Description

technical field [0001] The invention relates to an integrated circuit packaging process, in particular to a method for epoxy resin molding and packaging an SMT crystal resonator or oscillator. Background technique [0002] SMT crystal resonators or oscillators are widely used, such as mobile phones, digital cameras, etc. each need 1, and each notebook computer needs 4 to 6. This type of product is also a must in global satellite positioning system (GPS) and mobile communications. Indispensable components, there are also a large number of applications in personal digital assistants (PDA) and satellite receivers. With the rapid development of communication and information industries, the demand for SMT crystal resonators and oscillators is on the rise year after year, with an annual growth rate of 10% to 50%. [0003] SMT crystal resonators or oscillators are constructed as image 3 As shown, including a base 2, a metal case 3 and a quartz plate 4, the SMT crystal resonator h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03H3/02
Inventor 刘胜刘勇曾珂范旺生
Owner WUHAN WINNINGCHINA MICROSYST TECH
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