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Plasma antenna and plasma process apparatus including the same

A processing device, plasma technology, applied in the direction of antenna support/installation device, plasma, antenna, etc., can solve the problems of complex shape, difficult mass production, low efficiency of plasma generation, etc.

Active Publication Date: 2010-06-16
SEMES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, due to the existence of the frame 20, the effective area of ​​the dielectric 30 is reduced, so that the generation efficiency of the plasma is low.
[0009] Especially in the outer periphery of the four corners including the dielectric 30 and the central part where the cross-shaped frame 20 is located, the efficiency of the generated plasma is low
[0010] In order to solve the problem of low plasma efficiency in the above-mentioned places, although various shapes of plasma antennas have been studied, it is difficult to mass-produce them due to their complex shapes, and the plasma efficiency in the above-mentioned places has not been greatly improved.

Method used

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  • Plasma antenna and plasma process apparatus including the same
  • Plasma antenna and plasma process apparatus including the same
  • Plasma antenna and plasma process apparatus including the same

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Embodiment Construction

[0026] The details of the embodiments are included in the detailed description and the drawings.

[0027] The advantages, features and methods for realizing the present invention can be clearly understood by referring to the accompanying drawings and the embodiments described in detail below. However, the present invention is not limited to the embodiments disclosed below, and can be embodied in various forms different from each other. This embodiment is provided only to complete the disclosure of the present invention and to enable those with common sense in the technical field of the present invention to fully understand the invention, and the present invention can only be defined by the scope of the claims. And throughout the specification, the same reference numerals refer to the same constituent elements.

[0028] Hereinafter, the present invention will be described by way of embodiments of the present invention with reference to the drawings illustrating a plasma antenn...

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Abstract

The aim of the invention is to provide a plasma antenna and a plasma process apparatus including the same. According to a technical solution of the invention, the plasma antenna according to an embodiment of the invention is used for the plasma antenna of the plasma process apparatus. The plasma antenna has a shape which is described as follows: the plasma antenna receives a power which is provided from a power supply part; the plasma antenna is branched to the periphery of dielectric at a branch part; the branched antennae are centralized to the middle part and are grounded at a grounding part.

Description

technical field [0001] The present invention relates to a plasma antenna and a plasma processing apparatus including the antenna; more specifically, to the shape of a plasma antenna used in a plasma processing apparatus for performing a plasma process on a large-area substrate. Background technique [0002] Plasma processing apparatuses are widely used in the manufacturing processes of semiconductor substrates and liquid crystal displays. A plasma processing apparatus activates a reactive gas into a plasma state, and processes a predetermined region of a semiconductor substrate with cations or radicals (radicals) of the reactive gas in the plasma state. [0003] Plasma treatment devices include PECVD (Plasma Enhanced Chemical Vapor Deposition) devices for thin film evaporation. Etching equipment, sputtering (Sputter), ashing (Ashing) equipment, etc. to pattern the thin film deposited by etching. [0004] The plasma source of this type of plasma generator includes a power-c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01Q21/00H01Q1/26H05H1/46H01L21/3065
CPCH01J37/3211H01J37/32174H01Q1/366H05H1/46H05H1/4652H05H2242/20
Inventor 吴贤泽李昌桓卢一镐孔炳润李正仁
Owner SEMES CO LTD
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