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Diamond grinding material sequential arraying system and method

A diamond and abrasive technology, applied in the field of diamond abrasive orderly arrangement system, can solve the problems of high cutting resistance, expensive equipment, difficult to promote, etc., and achieves the effects of high degree of automation, low equipment cost, and easy promotion.

Inactive Publication Date: 2011-08-24
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The process has the following problems: (1) Mechanical mixing cannot ensure that the diamond abrasive is evenly distributed in the metal bond, resulting in a high concentration of diamond abrasive in some areas, too low in some areas, and no diamond abrasive in some areas; Uneven distribution, the cutting efficiency of the saw blade decreases, the cutting resistance is high in areas with high diamond abrasive concentration, the chips are easy to clog, and the cutting efficiency is low
This process has a high degree of automation, but because it is arranged piece by piece, the production efficiency is low. In addition, the equipment is expensive and difficult to promote
[0007] The "vacuum material distributing machine (patent number 2008200616561656.4)" developed by Chengdu Zhonghao Superhard Material Co., Ltd. in my country is to vibrate and drop the diamond abrasive in the through-hole formwork of the material through a vibrator. There is a certain distance between the matrix and the thin blank, and the diamond abrasives arranged in an orderly manner in the hole template are disordered during the vibration blanking process, and the diamonds falling on the surface of the matrix thin layer are not neatly arranged, which affects the cutting of the cutter head Efficiency and beauty
[0008] In short, due to the short period of research on the technology of orderly arrangement of abrasives, the existing technology of orderly arrangement of diamond abrasives is obviously deficient, mainly in the aspects of low production efficiency, low precision of arrangement, and expensive equipment.

Method used

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  • Diamond grinding material sequential arraying system and method
  • Diamond grinding material sequential arraying system and method
  • Diamond grinding material sequential arraying system and method

Examples

Experimental program
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Effect test

Embodiment Construction

[0024] A system for orderly arranging diamond saw blades with abrasive materials, the operation steps are as follows:

[0025] ① The embryo is placed on the upper surface of the support plate;

[0026] ② Use the magnet block under the support plate to adsorb and fix the embryo;

[0027] ③Apply pressure-sensitive adhesive evenly on the upper surface of the embryo;

[0028] ④Move the diamond abrasive adsorption device to the vicinity of the diamond abrasive supply area, move the piston upward, and the airflow passes through the stepped hole in the elastic plate to adsorb and fix the diamond abrasive in the stepped hole;

[0029] ⑤ Move the diamond abrasive adsorption device to the top of the cold-pressed thin billet support platform of the cutter head, move the cylinder liner down, and the diamond abrasive is in contact with the glue on the surface of the embryo;

[0030] ⑥When the piston moves down, the airflow formed is discharged from the step hole in the elastic plate, and...

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Abstract

The invention relates to a diamond grinding material sequential arraying system and a method, belonging to the field of grinding material and tool manufacturing. The system comprises a cylinder sleeve (3) and a piston (4). The piston (4) which can move up and down is arranged in the cylinder sleeve by a piston rod (1), the cylinder sleeve is sealed with the piston by a sealing ring (5), an elastic plate (6) is fixed at the lower end face of the cylinder sleeve by a screw (7) and a pressing plate (8), and stepped holes are sequentially arrayed in the elastic plate. The system further comprisesa worktable (14) and a supporting plate (12) arranged on the worktable (14) by a magnet block (13). With low cost and easy popularization, the system and the method can effectively, accurately and sequentially array and distribute diamond grinding materials.

Description

technical field [0001] The invention relates to a system and a method for orderly arranging diamond abrasives, belonging to the field of abrasives and abrasive tool manufacturing. Background technique [0002] Materials such as granite, marble, concrete, asphalt are typical examples of cutting with diamond saw blades. The diamond saw blade has a cutting layer of diamond abrasive on the periphery of the saw blade substrate. A sawing bit usually consists of diamond particles and a metal matrix that holds the diamond. At present, the production process commonly used in diamond saw blades: add a certain concentration of diamond to metal binders (such as iron powder, copper powder, tin powder, nickel powder, cobalt powder, etc.), and use mechanical mixing to combine Diamonds are mixed with a metal bond, loaded into molds for billeting and sintering. The process has the following problems: (1) Mechanical mixing cannot ensure that the diamond abrasive is evenly distributed in th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24D18/00B23P5/00
Inventor 肖冰
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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