Halogen-free flame-retardant environment-friendly epoxy electronic encapsulating material

An environmentally friendly and encapsulating material technology, which is applied in other chemical processes, chemical instruments and methods, etc., can solve the problems of low flame retardancy, heat and humidity resistance, low breakdown strength, and affect the quality of electronic products, and achieve temperature resistance The effect of good impact performance and good flame retardancy

Inactive Publication Date: 2010-06-23
XIANYANG WEIHUA INSULATION MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The existing domestic electronic encapsulation materials contain harmful substances such as halogen and antimony elements, whic

Method used

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  • Halogen-free flame-retardant environment-friendly epoxy electronic encapsulating material
  • Halogen-free flame-retardant environment-friendly epoxy electronic encapsulating material
  • Halogen-free flame-retardant environment-friendly epoxy electronic encapsulating material

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Embodiment Construction

[0014] Halogen-free flame retardant and environment-friendly epoxy electronic encapsulation compound consists of eight substances including epoxy resin, silicon micropowder, curing agent, 2-methylimidazole, internal flame retardant, leveling agent, pigment and laser marking agent. Wherein the weight ratio of various substances is epoxy resin: silica powder: curing agent: 2-methylimidazole: 1 internal flame retardant: leveling agent: pigment: laser marking agent=43: 42: 5: 0.2: 4 : 1: 2: 2.8.

[0015] The production method of the halogen-free flame-retardant and environment-friendly epoxy electronic encapsulation compound is as follows:

[0016] 1. Put silicon micropowder, curing agent, 2-methylimidazole, 1 internal flame retardant, leveling agent, titanium dioxide, and laser marking agent in iron, and then put them in an oven, and heat them at temperatures above 120°C to 130°C ℃ for one hour, take it out and wait for the temperature to drop below 30℃ for later use; grind the ...

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Abstract

The invention discloses a halogen-free flame-retardant environment-friendly epoxy electronic encapsulating material, which consists of epoxy resin, silica micro-powder, a curing agent, 2-methylimidazole, an inner flame retardant agent, a flatting agent, pigment and a laser marking agent, and the weight ratio of the eight substances is: epoxy resin: silica micro-powder: curing agent: 2-methylimidazole: inner flame retardant agent: flatting agent: pigment: laser marking agent is equal to 43: 42: 5: 0.2: 4: 1: 2: 2.8. The epoxy resin is crushed, and the rest substances are dried; all materials are arranged inside a hopper of a mixing machine to be blended; the mixed material is mixed in an extruding machine; and finally the mixed material flows to a tablet press to be cooled and crushed. The product has favorable flame-retardant property, moisture resistance and good laser developing effect, is a latest halogen-free antimony-free environment-friendly electronic encapsulating material, is used for the outer encapsulation of the electronic parts, and can play the effects of moisture resistance, insulation, mechanical protection and the like.

Description

technical field [0001] The invention relates to an electronic encapsulation material, in particular to a halogen-free flame-retardant and environment-friendly epoxy electronic encapsulation material. Background technique [0002] The existing domestic electronic packaging materials contain harmful substances such as halogens and antimony elements, which have low heat and humidity resistance, breakdown strength, and low flame retardancy, which affect the quality of electronic products. Contents of the invention [0003] The technical problem to be solved by the present invention is: to remove the harmful substances halogen and antimony elements of the electronic encapsulation material, so that the electronic encapsulation material has excellent heat resistance and high breakdown strength, and the temperature resistance, impact performance and flame retardancy are all excellent. very high. [0004] The present invention is realized in this way: it consists of eight substanc...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K3/36C08K5/3445C09K3/10
Inventor 刘念杰林永利徐文辉吴先锋
Owner XIANYANG WEIHUA INSULATION MATERIALS
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