Suspending manufacture process of light emitting diode (LED) fluorescent powder
A manufacturing process and fluorescent powder technology, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of small size of low-power LED, uneven light spot, high technical difficulty, etc., achieve strong anti-attenuation ability, improve utilization rate, even coverage effect
Inactive Publication Date: 2010-06-23
BONSHINE OPTICAL ELECTRON TECH
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Problems solved by technology
[0002] Since the appearance of LED, it has been loved by people because of its energy saving and environmental protection. With the breakthrough of technology, the white LED appears, and its application in the lighting field is becoming more and more extensive. However, phosphor deposition is a problem that has always existed in the white LED manufacturing process. Yes, during the LED production and preparation process, the phosphor powder in it usually produces very serious precipitation after baking, and a part of the phosphor powder precipitates around the wafer, resulting in the phosphor powder coated inside the finished LED product when it is used. Low utilization rate, causing problems such as uneven light spots
In order to solve this problem, the best way is to apply phosphor on the surface of the chip. However, due to the small size of low-power LEDs, how to complete the application of phosphor on the small surface is very difficult technically, and it is a process problem that needs to be overcome urgently in the industry.
Method used
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[0041] Such as figure 1 Shown, the present invention relates to a kind of LED phosphor suspension manufacturing process, it comprises the following steps
[0042] a), solid crystal baking
[0043] Put insulating glue in the middle of the bracket of the lamp cup, bond the light-emitting chip to the bracket, and then put it in a hot air circulation oven and bake at 130-150 degrees Celsius for 60 minutes to cure the insulating glue;
[0044] The peeling force of the wafer and the support should be greater than 70 grams;
[0045] b), welding wire
[0046] Through the special LED wire bonding equipment, the gold wire is soldered to the chip pad and the bracket to form a power circuit;
[0047] The tearing force of the welded gold wire should be greater than 5 grams;
[0048] c), apply epoxy resin
[0049] Put an appropriate amount of epoxy resin on the chip in the lamp cup, it is best to just cover the chip. The epoxy resin is a transparent two-component epoxy resin, wherein A...
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The invention provides a suspending manufacture process of light emitting diode (LED) fluorescent powder. In the manufacture process, transparent epoxy resin and fluorescent powder are adopted for coating twice, wherein for the first coating, the transparent epoxy resin is used for exactly covering a wafer, and the wafer is roasted and cured, then a mixed materials prepared from the fluorescent powder and the epoxy resin is coated on the epoxy resin in the first coating, and the wafer is roasted, deposited and cured again, thereby the transparent epoxy resin and the fluorescent powder are uniformly distributed on the surface of an LED lamp cup wafer. In addition, by combining a corresponding finished product detection mode, the fluorescent powder in a produced LED finished product is uniformly covered, thereby the utilization rate of the fluorescent powder in the finished LED product is greatly improved when in use, and the prepared LED light spot has the advantages of uniformity, strong attenuation resisting capability and the like.
Description
【Technical field】 [0001] The invention relates to a manufacturing process of an LED element, in particular to a manufacturing process of LED fluorescent powder suspension for evenly distributing fluorescent powder by means of a suspension method during LED manufacturing. 【Background technique】 [0002] Since the appearance of LED, it has been loved by people because of its energy saving and environmental protection. With the breakthrough of technology, the white LED appears, and its application in the lighting field is becoming more and more extensive. However, phosphor deposition is a problem that has always existed in the white LED manufacturing process. Yes, during the LED production and preparation process, the phosphor powder in it usually produces very serious precipitation after baking, and a part of the phosphor powder precipitates around the wafer, resulting in the phosphor powder coated inside the finished LED product when it is used. The utilization rate is low, c...
Claims
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IPC IPC(8): H01L33/00
Inventor 叶建
Owner BONSHINE OPTICAL ELECTRON TECH