Stannum-stibium intermediate alloy and preparation process thereof

An intermediate alloy and preparation technology, which is applied in the field of tin-antimony alloy, can solve the problems affecting the physical and chemical properties of packaging solder, uneven distribution of composition components, increasing the difficulty and cost of preparation, etc., to improve the anti-oxidation ability and anti-oxidation Ability and the effect of shortening the stirring time

Inactive Publication Date: 2010-06-30
高新锡业(惠州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The tin-antimony master alloy produced by this preparation process is prone to uneven distribution of components, which affects the physical and chemical properties of the packaging solder, and the preparation process is cumbersome, time-consuming, and the temperature is high during preparation, which increases the difficulty and cost of preparation.
Therefore, it is of great significance to solve the technical problem that the existing multi-element alloy preparation process cannot completely overcome the uneven distribution of each combination component in each multi-element alloy and improve the compatibility of various alloy components in the multi-element alloy to make good use of multi-element alloy solder.

Method used

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Examples

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preparation example Construction

[0014] The preparation technology of this tin-antimony master alloy comprises the following steps:

[0015] 1. Place the quantitative component antimony Sb in the mold;

[0016] Two, according to weight ratio, the mold that antimony ingot is housed in the step 1 is immersed in the tin pot that contains quantitative base material tin Sn, and adds quantitative component gallium Ga;

[0017] 3. A tin-antimony master alloy with a certain content of each component is prepared by stirring and casting.

[0018] The preparation process makes each component in the tin-antimony master alloy have good uniformity and high uniformity by changing the conventional feeding sequence and method, and effectively improves the compatibility and phase state distribution of each alloy component. In addition, the preparation process is simple, the stirring time in the preparation process is obviously shortened, it is easy to realize in industry, and the production efficiency can be effectively impro...

Embodiment 1

[0022] In terms of weight percentage, the base material and each component are proportioned as follows: tin Sn: 94.5%, antimony Sb: 5%, gallium Ga: 0.5%.

[0023] 1. Place 5% antimony Sb in the mold;

[0024] Two, the mold that antimony ingot is housed in the step 1 is immersed in the tin pot that contains 94.5% base material tin Sn, and adds the component gallium Ga of 0.5%;

[0025] 3. Prepare tin-antimony master alloy by stirring and casting.

[0026] The antimony Sb and other components in the prepared tin-antimony master alloy have good uniformity and high uniformity, the compatibility of each alloy component is good and the oxidation resistance is good, and the production time of the tin-antimony master alloy is short.

Embodiment 2

[0028] In terms of weight percentage, the base material and each component are proportioned as follows: tin Sn: 92%, antimony Sb: 7.5%, gallium Ga: 0.5%.

[0029] 1. Melting and casting 7.5% component antimony Sb in the mould;

[0030] Two, the mold that antimony ingot is housed in the step 1 is immersed in the tin pot that contains 92% base material tin Sn, and adds the component gallium Ga of 0.5%;

[0031] 3. Prepare tin-antimony master alloy by stirring and casting.

[0032] The antimony Sb and other components in the prepared tin-antimony master alloy have good uniformity and high uniformity, the compatibility of each alloy component is good and the oxidation resistance is good, and the production time of the tin-antimony master alloy is short.

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PUM

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Abstract

The invention discloses a stannum-stibium intermediate alloy and a preparation process thereof. The stannum-stibium intermediate alloy takes stannum (Sn) as the base material and also comprises the following components by weight percent: 0.1-30 percent of stibium (Sb) and 0.01-5 percent of gallium Ga. Preferably, the content of the base material Sn is 75-95 percent, the content of Sb is 5-25 percent, and the content of Ga is 0.1-5 percent. The stannum-stibium intermediate alloy can be used for synthesizing various multicomponent alloys or multicomponent alloy tin solders, and ensures that various alloy components have uniform phasestate distribution and good compatibility. The preparation process comprises the following steps of: fusing and casting quantitive component Sb into a die; immersing the die loaded with a stibium ingot into a stannum pot filled with quantitive base material Sn according to the weight proportion, and adding quantitive component Ga; stirring and casting to prepare the stannum-stibium intermediate alloy with defined content of each component. The preparation process has simplified working procedures, can obviously shorten the production time of stannum-stibium alloys and reduce the cost.

Description

technical field [0001] The invention relates to the technical field of tin-antimony alloys, in particular to components of tin and antimony in a tin-antimony master alloy and a preparation process thereof. Background technique [0002] Because tin-lead alloy has good wettability and electrical conductivity, good soldering performance and low cost, tin-lead alloy is often used as solder in the electronics industry at present. However, human long-term scientific research and practice have proved that lead and its compounds are very harmful to human health, causing serious pollution to the ecological environment, and even endangering the survival of other organisms. Therefore, the society has increasingly stringent requirements on the environmental protection performance of products, and the electronic industry has also adopted various standards to limit the lead content of electronic products. A new type of environmentally friendly lead-free solder with the advantages of good...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C13/00C22C13/02C22C1/02
Inventor 苏明斌苏传港苏燕旋苏传猛郭黎
Owner 高新锡业(惠州)有限公司
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