Method for forming pre-welding material of packaging base plate

Abstract

The invention discloses a method for forming a pre-welding material of a packaging base plate. The method comprises the following steps of: preforming an anti-sticking layer on a welding cover layer of one surface of the base plate, and adhering a dry film photoetching glue; after patterning the dry film photoetching glue, printing welding material, and refluxing the welding material into a plurality of pre-welding materials. After the pre-welding material is completed, the dry film photoetching glue can be easily torn away from the anti-sticking layer, and the pre-welding material is cured at the same time, thereby truly enhancing the stability of the manufacture process, the yield rate of the base plate, and the layout density of the pre-welding material, and satisfying the miniature requirement of the semiconductor packaging structure.

Description

【Technical field】 [0001] The invention relates to a method for forming pre-solder on a substrate for packaging, in particular to a method for forming pre-solder on a substrate for packaging by using an anti-adhesion layer and a dry film photoresist. 【Background technique】 [0002] Nowadays, in order to meet various high-density packaging requirements, the semiconductor packaging industry has gradually developed various types of packaging structures, among which the common packaging structures with substrates include ball grid array packaging structures (ball grid array, BGA) , a pin grid array package structure (pin grid array, PGA), a land grid array package structure (land grid array, LGA) or a board on chip package structure (board on chip, BOC), etc. In the above packaging structure, at least one chip is carried on an upper surface of the substrate, and several pads of the chip are electrically connected to the substrate through a wire bonding or bumping manufacturing pr...

AI Technical Summary

Problems solved by technology

[0004] However, the disadvantages of the above-mentioned method for forming pre-solder on the substrate for packaging are as follows: Figure 1B and 1C As shown, when the template 12 is removed, the solder 13 has not yet solidified, so the uncured solder 13 may adhere to the opening 121 of the template 12, and part or all of the solder is taken away by the template 12 13

However, in this method, since the dry film is usually tightly adhered to the solder mask layer on the surface of the substrate, it is easy to be difficult to remove the dry film smoothly, and may cause the dry film to crack and remain On the substrate, or on the surface of the part of the solder mask layer that takes away the substrate during peeling

As a result, the yield rate of the substrate may be affected

Images