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Composite gold wire and manufacture method thereof

A manufacturing method and composite gold technology are applied in the field of metal bonding wires, which can solve the problems of increased cost and high cost of semiconductor components, and achieve the effect of reducing costs

Inactive Publication Date: 2010-07-28
李俊德
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Metal bonding wires made of pure gold have better physical properties such as ductility and electrical conductivity. However, due to the high cost of metal bonding wires made of pure gold, it also increases the overall cost of semiconductor components.

Method used

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  • Composite gold wire and manufacture method thereof
  • Composite gold wire and manufacture method thereof
  • Composite gold wire and manufacture method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] The main metal raw material with silver component is placed in a vacuum furnace for smelting and manufacturing, and the secondary metal raw material with palladium component is added into the vacuum furnace, and then mixed and smelted by the vacuum furnace to produce a silver-palladium alloy molten liquid. The composition of the silver-palladium alloy molten liquid includes: 99.99% by weight of silver components, and 0.01% by weight of palladium components.

[0027] The silver-palladium alloy molten liquid is continuously cast and then drawn to draw a silver-palladium alloy wire rod with a wire diameter of 4 mm. The silver-palladium alloy wire is coiled by a winder, and the composition analysis of the silver-palladium alloy wire is carried out.

[0028] After the silver-palladium alloy wire casting is completed, the wire diameter is stretched, so that the wire diameter that was originally 6mm is stretched to 3mm through the first thick wire drawing machine, stretched to...

Embodiment 2

[0031] The main metal raw material with silver component is placed in a vacuum melting furnace, and the secondary metal raw material with palladium component is added into the vacuum melting furnace, and then the silver-palladium alloy molten liquid is produced by mixing and melting in the vacuum melting furnace. The components of the silver-palladium alloy molten liquid include: 95.00% by weight of silver components, and 5.00% by weight of palladium components.

[0032] The silver-palladium alloy molten liquid is continuously cast and then drawn to draw a silver-palladium alloy wire rod with a wire diameter of 6 mm. The silver-palladium alloy wire is coiled by a winder, and the composition analysis of the silver-palladium alloy wire is carried out.

[0033] After the silver-palladium alloy wire casting is completed, the wire diameter is stretched, so that the original wire diameter of 6mm is stretched to 3mm through the first thick wire drawing machine, stretched to 1.0mm thr...

Embodiment 3

[0036] The main metal raw material with silver component is placed in a vacuum melting furnace, and the secondary metal raw material with palladium component is added into the vacuum melting furnace, and then the silver-palladium alloy molten liquid is produced by mixing and melting in the vacuum melting furnace. The composition of the silver-palladium alloy molten liquid includes: 90.00% by weight of silver components, and 10.00% by weight of palladium components.

[0037] The silver-palladium alloy molten liquid is continuously cast and then drawn to draw a silver-palladium alloy wire rod with a wire diameter of 8 mm. The silver-palladium alloy wire is coiled by a winder, and the composition analysis of the silver-palladium alloy wire is carried out.

[0038] After the silver-palladium alloy wire casting is completed, the wire diameter is stretched so that the wire diameter that was originally 8mm is stretched to 2mm through the first thick wire drawing machine, stretched to...

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Abstract

The invention provides a manufacture method of a composite gold wire, comprising the steps of providing a main metal raw material containing a silver componnet; putting the main metal raw material in a vacuum melting furnace and carrying out mixing melting after adding a minor metal material containing a palladium component in the vacuum melting furnace and mixing to prepare a silver-palladium alloy melting liquid; then continuously casting and pulling and stretching the silver-palladium alloy melting liquid into a silver-palladium alloy wire rod; and at last, stretching the silver-palladium alloy wire rod into a silver-palladium alloy bonding wire with the preset wire diameter. The invention also provides the composite gold wire comprising the following ingredients in percentage by weight: 90.00-99.99 percent of silver and 0.01-10.00 percent of palladium. By dint of the silver-palladium alloy bonding wire prepared by mixing the two metal raw materials such as silver and palladium, the invention can not only achieve the effect of metal wire rods made of pure gold but also greatly reduce the cost.

Description

technical field [0001] The invention relates to a metal bonding wire, in particular to a composite gold wire used in a semiconductor packaging process and a manufacturing method thereof. Background technique [0002] In the packaging process of semiconductor components, the metal bonding wire is often connected to the chip and the circuit substrate by wire bonding, and the chip and the circuit substrate are electrically connected by the metal bonding wire to serve as signal and current transmission between the chip and the circuit substrate. path. [0003] Generally speaking, the main characteristics of metal bonding wires, such as load strength, ductility, bending, melting point, electrical properties, hardness, and welding ability to integrated circuit (IC) chips, are related to the materials used. The above characteristics will affect the life and stability of the semiconductor device. According to the different types of chips and circuit substrates, the specifications ...

Claims

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Application Information

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IPC IPC(8): B22D21/00B21C1/00C22C5/06
Inventor 李俊德
Owner 李俊德
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