Bonding agent applicable to copper foil cladding laminated board with full light shading performance

A technology of copper-clad laminates and adhesives, which is applied in the field of electronic information, can solve problems such as accelerating product penetration, and achieve the effect of excellent mechanical properties

Active Publication Date: 2010-07-28
NANYA NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

From the perspective of demand, the advancement of light guide plate technology has increased the penetration rate of LEDBLU, and the increase in light rate will accelerate the popularization of lighting applications, but the price is still too high; but from the perspective of supply, the price competition of Japanese factories and the oversupply of Taiwanese factories will make prices However, the price drop on the supply side will cause small profits but quick turnover to stimulate the market. If the demand continues to increase, it can relieve the pressure of oversupply and accelerate product penetration. Coupled with the heating up of energy issues, countries will formulate regulations and standards to promote the LED industry. develop
[0004] The existing epoxy glass cloth-based copper clad boards are semi-transparent

Method used

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  • Bonding agent applicable to copper foil cladding laminated board with full light shading performance
  • Bonding agent applicable to copper foil cladding laminated board with full light shading performance
  • Bonding agent applicable to copper foil cladding laminated board with full light shading performance

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] 1) Additive formula (by weight share):

[0047] Nigrosine Silica powder Acetone

[0048] 11 45 45

[0049] 2) Adhesive formula (by weight):

[0050] Resin Dicyandiamide Dimethylimidazole Dimethylformamide Additive

[0051] 125 2.5 0.2 30 25

[0052] 3) Glue drying:

[0053] Oven temperature setting: 150-210°C,

[0054] Prepreg gluing speed: 12-15m / min.

[0055] 4) Prepreg control parameters:

[0056] Gel time: 115sec Epoxy resin content: 42% (refers to the mass percentage of epoxy resin in the prepreg)

[0057] Resin fluidity: 20.5% Volatile matter: 0.25%

[0058] 5) Number of layers of sheet metal arrangement: 8 pieces of 7628 prepreg (1.6mm)

[0059] 6) Platen parameters:

[0060] Vacuum: -0.097MPa,

[0061] Pressure: 300-450psi,

[0062] Hot plate temperature: 135-220°C,

[0063] Curing time: 50min.

[0064] 7) Product substrate performance parameters

[0065]

Embodiment 2

[0067] 1) Additive formula (by weight share):

[0068] Nigrosine Silica powder Acetone

[0069] 12 45 45

[0070] 2) Glue mixing formula (by weight):

[0071] Resin Dicyandiamide Dimethylimidazole Dimethylformamide Additive

[0072]125 2.5 0.2 35 20

[0073] 3) Glue drying:

[0074] Oven temperature setting: 150-210°C,

[0075] Prepreg gluing speed: 12-15m / min.

[0076] 4) Prepreg control parameters:

[0077] Gel time: 115sec Epoxy resin content: 45.0%

[0078] Resin fluidity: 20.5% Volatile matter: 0.25%

[0079] 5) Number of layers of sheet metal arrangement: 8 pieces of 7628 prepreg (1.6mm)

[0080] 6) Platen parameters:

[0081] Vacuum degree: -0.097Mpa,

[0082] Pressure: 300-450psi,

[0083] Hot plate temperature: 135-220°C,

[0084] Curing time: 50min.

[0085] 7) Product substrate performance parameters

[0086]

[0087]

Embodiment 3

[0089] 1) Additive formula (by weight share):

[0090] Nigrosine Silica powder Acetone

[0091] 11 40 40

[0092] 2) Glue mixing formula (by weight):

[0093] Resin Dicyandiamide Dimethylimidazole Dimethylformamide Additive

[0094] 125 3 0.3 30 30

[0095] 3) Glue drying:

[0096] Oven temperature setting: 150-210°C,

[0097] Prepreg gluing speed: 12-15m / min.

[0098] 4) Prepreg control parameters:

[0099] Gel time: 115sec Epoxy resin content: 45.0%

[0100] Resin fluidity: 20.5% Volatile matter: 0.25%

[0101] 5) Number of layers of sheet metal arrangement: 8 pieces of 7628 prepreg (1.6mm)

[0102] 6) Platen parameters:

[0103] Vacuum degree: -0.097Mpa,

[0104] Pressure: 300-450psi,

[0105] Hot plate temperature: 135-220°C,

[0106] Curing time: 50min.

[0107] 7) Product substrate performance parameters

[0108]

[0109]

[0110] The epoxy glass cloth-based copper clad laminate substrate has a light transmittance of <0.1% in the visible light region...

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Abstract

The invention belongs to the technical filed of electronic information, in particular to a bonding agent capable of changing the light shading performance of various copper cladding laminated boards. The bonding agent is prepared from epoxy resin, dicyandiamide, 2-methylimidazole, dimethylformamide and additives in proper percentage by weight, wherein the additives are made by proportionally mixing nigrosine and silicon micro powder, and the bonding agent can change the light shading performance of the copper cladding laminated boards on the premise of not changing the major performance parameter of the copper cladding laminated boards. When being used, the copper cladding laminated boards after being improved by the invention has good mechanical property, and can be applied to LED products and high-end printed circuit boards with higher light shading requirements.

Description

technical field [0001] The invention belongs to the technical field of electronic information, and specifically relates to an adhesive for epoxy glass cloth-based copper-clad laminates suitable for LED products and high-end printed circuit boards with higher requirements for light protection. Background technique [0002] At present, investment in the LED industry is a hot key project, and all countries in the world pay more attention to the R&D and production of LEDs. The LED industry has experienced many ups and downs since its development. Looking at the development trend of the LED industry, there is no doubt that it has achieved remarkable results. China has great advantages in developing the LED industry, especially LED display manufacturers. First of all, China has a huge market demand. Secondly, from the perspective of resources, China is rich in non-ferrous metal resources. Furthermore, the semiconductor lighting industry is a technology-intensive and labor-inte...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/06C09J11/04B32B7/12B32B15/092H05K1/03
Inventor 冀翔张东张桂秋阚春节杨涛
Owner NANYA NEW MATERIAL TECH CO LTD
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