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Thin film coating system and method

A coating, thin-film technology applied in high-rate exposure to the target area, which can solve the problems of overall productivity reduction, limitation, incomplete oxidation of sputtering system, etc.

Inactive Publication Date: 2010-08-18
DEPOSITION SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] A limitation of prior art sputtering systems is the onset of incomplete oxidation as the average deposition rate increases
To avoid incomplete oxidation in common systems, the power supplied to the sputtering target must be limited, resulting in a reduction in the overall productivity of the system

Method used

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Embodiment Construction

[0028] The following describes various embodiments of the thin film coating system and method with reference to the accompanying drawings. In the accompanying drawings, the same elements are given the same numerals to facilitate understanding of the present invention. Example films can include but are not limited to: TiO 2 , Golden Red TiO 2 , SiO 2 , Tin-doped indium oxide, Ta 2 O 5 , Nb 2 O 5 , Other metals and metal oxides, nitrides and carbides, used to form non-sputtered coatings, sputtered coatings, wear-resistant coatings and their combinations.

[0029] In the preceding paragraphs, the embodiments of the present invention were viewed macroscopically based on the sputtering target area relative to the total substrate area to be coated. Due to the rapid movement of the substrate, this macroscopic observation can be equivalent to making the coating thinly spread over a much larger area (compared to the area adjacent to the sputtering target instantaneously), thereby increasin...

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Abstract

A method and system for depositing a thin film on a substrate. In the system a target material is deposited and reacted on a substrate surface to form a substantially non- absorbing thin film. The volume of non-absorbing thin film formed per unit of time may be increased by increasing the area of the surface by a factor of 'x' and increasing the rate of deposition of the target material by a factor greater than the inverse of the factor 'x' to thereby increase the rate of formation of the volume of non-absorbing thin film per unit of time.

Description

[0001] Related application [0002] This application and provisional patent application No. 60 / 996063 are jointly pending and claim its priority. The application date of provisional patent application No. 60 / 996063 is October 26, 2007, with the title "Thin Film Coating System and Method" ", the applicant is the same as this application, and the entire document is cited in this article. [0003] This application is pending with U.S. Patent Application No. 12 / 155544 and is a part of its continuation application. The application date of U.S. Patent Application No. 12 / 155544 is June 5, 2008. It requires provisional patent application No. 60. / 924930 (application date June 5, 2007) priority, titled "Low Cost High Rate Deposition Tooling", the entire document is cited in this article. Background technique [0004] Embodiments of the present invention generally involve the deposition of reactive sputtered films on substrates. Exemplary films can be composed of two or more elements, includ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/00
CPCC23C14/505C23C14/3492
Inventor N·L·博林M·雷恩斯H·R·格雷
Owner DEPOSITION SCI