Copper alloy powder and method for producing the same
A manufacturing method and technology of copper alloys, applied in metal/alloy conductors, cable/conductor manufacturing, conductive materials, etc., can solve the problems of not being able to exceed 800 °C and lowering, and achieve low resistivity, excellent oxidation resistance, and equipment costs. cheap effect
Inactive Publication Date: 2010-08-25
SINTOKOGIO LTD
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Problems solved by technology
However, still unable to exceed 800°C
As mentioned above, the copper alloy powders used in the conductive pastes of electronic parts disclosed in the prior art all have improved oxidation resistance
Method used
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Disclosed is a copper alloy powder having excellent oxidizability and electrical conductivity, whose sintering starting temperature can be set discretionally. This copper alloy powder enables low production cost, that is composed of the costs for raw materials and production facilities. Specifically disclosed is a copper alloy powder composed of 0.05-3.00% by mass of aluminum, and the balance of copper and unavoidable impurities, while additionally containing 0.01-0.10% by mass of boron, if necessary. This copper alloy powder is granulated by a water atomization process.
Description
Copper alloy powder and manufacturing method thereof technical field The present invention relates to copper alloy powder most suitable for conductive paste used in electronic components and a method for producing the same. Background technique Copper alloy powder is widely used as a material for conductive paste or conductive filler used for circuit formation of electronic circuit boards, embedding of through holes, or electrode formation of multilayer capacitors. As its characteristics, low requirements are required. Resistivity and high oxidation resistance, and sintering characteristics with the base material corresponding to the application are required. For example, when used to form the outer layer circuit of a multilayer capacitor, in order to mount the external electrodes to the completed sintered body and connect to the substrate pattern, it is desired not to damage the sintered body, and to prevent resistance due to oxidation It is hoped that it will not be ox...
Claims
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Login to view more IPC IPC(8): C22C9/01B22F1/00B22F9/08C22C9/00H01B1/02H01B13/00
CPCH01B1/026C22C9/01B22F2009/0828C22C9/00B22F9/082
Inventor 木野泰志梶田浩二玉木贤治
Owner SINTOKOGIO LTD
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