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Grindstone for conditioning of surface plate

A platform and grinding stone technology, applied in the field of grinding stones for platform correction, can solve problems such as processing obstruction, burrs, rough surface of cast iron platforms, etc.

Inactive Publication Date: 2010-09-01
SHINANO ELECTRIC REFINING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, these platform correction jigs must be corrected and polished for a long time in order to correct and flatten the platform. After polishing, burrs are generated on the holes produced by the combustion of granular graphite on the surface of the cast iron platform, and the surface of the cast iron platform becomes rough state
In addition, in recent years, the size of the polishing machine has been significantly increased, and the platform correction jig must also be enlarged in proportion, and the weight of the jig also increases, which hinders the handling.

Method used

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  • Grindstone for conditioning of surface plate
  • Grindstone for conditioning of surface plate
  • Grindstone for conditioning of surface plate

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Embodiment Construction

[0090] Best Mode for Carrying Out the Invention

[0091] The platform correction polishing device of the present invention is as figure 2 as shown in figure 1 In the polishing device, the platform correction carrier 10 having the hole 11 for holding the grinding stone for correction is not provided with the carrier 4, and the gears 2 and 3 are meshed with each other, and the grinding wheel for correction is held in the hole 11 of the carrier 10. Stone 12, so that the polishing platform 1 and the carrier 10 are rotated respectively, and free abrasive grains are supplied to the polishing platform for correction polishing. At this time, the correction grinding stone 12 provided in the hole 11 of the carrier 10 is fan-shaped, and is composed of a synthetic resin grinding stone, a cast iron grinding stone, etc.; the hole 11 is fan-shaped corresponding to the shape of the grinding stone. A hole portion, and the hole portion 11 is fitted with, for example, a plate-shaped (plate-sh...

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Abstract

The invention provides a grindstone for conditioning of a surface plate. In a lapping machine comprising a lapping plate and a conditioning carrier disposed thereon, the carrier being provided with bores for receiving conditioning grindstone segments, the lapping plate is polished and conditioned by cooperatively rotating the lapping plate and the carrier and feeding loose abrasive grains to the lapping plate. The conditioning grindstone segment of a shape of arcuated trapezoid having an included angle of 180 DEG - 90 DEG is fitted in the carrier bore. When a workpiece is actually lapped using loose abrasive grains, adequate abrasive grains are caught within opened spheroidal graphite holes on the lapping plate surface, the retaining force of grains within holes is increased to produce a stable lapping force, and the fine texture surface of the lapping plate is transferred to the workpiece. Thus the workpiece is finished to a minimal surface roughness.

Description

technical field [0001] The invention relates to a grinding stone for platform correction, a polishing device for platform correction and a correction method for the polishing platform. The grinding stone for platform correction is used to correct the polishing platform in the polishing device, and the polishing device is on the polishing platform. A platform correction carrier having a hole for holding a grinding stone for correction is provided, and a grinding stone for correction is held in the hole of the carrier so that the polishing platform and the carrier are rotated separately, and free abrasive grains are supplied to the polishing platform so that the Polishing platform polishing. Background technique [0002] In the past, in terms of polishing devices for polishing polishing workpieces such as silicon wafers, synthetic quartz glass, crystals, liquid crystal glasses, and ceramics, some people have used figure 1 device shown. here, figure 1 One of them is a polish...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D3/20B24B29/00B24B53/013B24B53/02B24B53/12B24D3/32B24D7/06
CPCB24B53/12B24B53/013B24B53/02B24D7/06B24B53/017H01L21/304
Inventor 安冈快清水强风间贤一
Owner SHINANO ELECTRIC REFINING
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