Laser measuring device for measuring thickness of plate

Abstract

The invention discloses a laser measuring device for measuring the thickness of a plate, which comprises a laser, a camera, a black screen and a computer. When the device is used, the laser and the black screen are positioned on two sides of the tested plate; a laser-emitting point S is above the bottom surface of the tested plate; a baffle plate is arranged on the emergent light path of the laser; the baffle plate blocks the laser beam which is about one third of spot diameter; the camera and the laser are positioned on the same side of the tested plate; the incident light hole T of the camera is positioned below the tested plate; an optical filter is arranged in front of a lens of the camera; and the computer is connected with the camera. The measuring method comprises the following steps of: due to the comprehensive utilization of the principles of a laser trigonometry and an optical imaging method, placing the laser slantways to irradiate on the side of a tested object to form a light band; filtering stray light except for the laser wavelength by using the optical filter; and then imaging the light band on a CCD target surface to obtain the thickness value of the tested object through image treatment. Compared with the laser thickness-measuring instrument adopting the double-laser triangle measurement, the laser measuring device has the advantages of convenient installation and great reduction in the high-temperature thermal radiation influence by the tested object.

Description

technical field [0001] The invention belongs to the technical field of linear dimension measurement, and relates to an object thickness measuring device, in particular to a laser measuring device for plate thickness. Since the principle of laser triangulation and optical imaging is comprehensively utilized for laser oblique illumination, it is easy to install and less affected by the high-temperature thermal radiation of the measured object. The invention can be used for plate thickness measurement in metallurgical industry and other fields. Background technique [0002] In order to meet the efficient, accurate and real-time online active measurement requirements of modern industry, various non-contact real-time online measurement methods have emerged. For plate thickness measurement, the non-contact thickness measurement methods used in various production lines at home and abroad are mainly Including ray method, eddy current method, capacitance method, optical method, etc....

AI Technical Summary

Problems solved by technology

[0003] The ray method has high measurement accuracy, which can reach less than or equal to ±0.2% of the thickness of the object to be measured, and can realize fast non-contact measurement, but the ray is harmful to the operator and pollutes the environment

[0004] At present, the upper and lower double laser triangulation method is mostly used for industrial field thickness measurement. The two probes are respectively located on the upper and lower sides of the tested plate, which brings certain difficulties to the installation. High temperature radiation, lasers, optical lenses and photosensitive devices will be affected, the measurement accuracy of the entire system is difficult to guarantee or even threaten its normal operation, and the service life of each device in the system will also be affected

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