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Reflow soldering method

A reflow soldering and soldering technology, which is applied in the direction of welding equipment, manufacturing tools, metal processing, etc., can solve the problem of flux components adhering to low-temperature locations other than flux recovery equipment

Active Publication Date: 2010-09-15
DENSO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it takes time to remove, and flux components that cannot be completely removed will likely adhere to low-temperature locations other than flux recovery equipment

Method used

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Embodiment Construction

[0014] based on the following figure 1 The apparatus 100 for performing the reflow soldering method of the embodiment of the present invention will be described. This equipment 100 is provided with: a processing chamber (reflow furnace) 1; an inlet 2 for delivering a printed circuit board W (hereinafter referred to as "workpiece W") mounted with electronic devices 11 into the processing chamber, and the reflow soldering application on the printed circuit board; the outlet 3, which is used to transport the workpiece W to the outside of the processing chamber; the heater 4 for heating the workpiece W; the fan 5, which stirs the ambient air or ambient gas in the processing chamber; and a conveying device that loads the workpiece W and conveys the workpiece into the processing chamber. Solder paste H is applied between the electronic device 11 and the workpiece W. As shown in FIG. This solder paste H has a saturated vapor pressure of about 0.1-0.15 MPa at a melting temperature o...

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PUM

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Abstract

The invention discloses a reflow soldering method, which does not allow that the solder component evaporates into the atmosphere gas and furthermore prevents various problems due to the solder in the soldering paste evaporating into the atmosphere gas and the solder component solidifying. The reflow soldering method comprises the following steps: transferring the workpiece for performing the reflow soldering to a sealability processing chamber; sealing the processing chamber; transferring the inert gas pressured into a high pressure higher than the saturation vapor pressure of the solder in the solder material at the solder fusion temperature into the processing chamber; keeping the pressure of the processing chamber higher than the saturation vapor pressure and meanwhile heating the workpiece to the reflow soldering temperature to keep the constant temperature of the workpiece; melting the solder adhered on the workpiece to perform reflow soldering.

Description

technical field [0001] The invention relates to a method of reflow soldering a printed circuit board on which electronic devices are mounted. Background technique [0002] Various electronic components are mounted and soldered directly to the surface of the printed circuit board. This soldering is performed using solder paste. Solder paste consists of a paste of creamy flux and powdered solder, and is applied to the solder joints of a printed circuit board by a printer or dispenser or similar device. Electronics are mounted at these points, and a reflow oven performs heating to solder the board and electronics together. [0003] The flux of the solder paste acts as a coating material that removes the oxide film on the metal surface being soldered, prevents re-oxidation due to heating during soldering, and reduces the surface tension of the solder to improve wetting. The flux includes rosin, thixotropic agent, activator, and other solid components dissolved by the solvent,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34B23K1/008
CPCB23K1/008B23K2201/42B23K2201/40B23K2101/40B23K2101/42
Inventor 助川拓士秋田直幸
Owner DENSO CORP