Soaking plate of foam metal and copper powder compounded capillary structure

Abstract

The invention discloses a soaking plate of a foam metal and copper powder compounded capillary structure. In the technical scheme, a main body is a vacuum chamber which consists of an upper cover and a lower cover, a compounded capillary structure formed by foam metal and copper powder is arranged in the chamber, the chamber is also filled with a certain quantity of working medium which can boil and transfer heat at a low temperature, the upper cover and the lower cover are both made of deoxidized plate, and the compounded capillary structure is formed through sintering a foam metal plate and copper powder of a certain size. Compared with the traditional capillary structure, the compounded capillary structure has the significant advantages of large lower capillary force, small upper osmotic resistance, accurate control of the capillary force, small thermal contact resistance and the like; and the capillary structures of the upper cover plate and the lower cover plate can be designed as a whole, thereby improving the backflow capacity. Compared with the traditional product, the soaking plate of the foam metal and copper powder compounded capillary structure has the significant advantages of low cost, high irradiating efficiency, long service life and the like when achieving the identical irradiating effect.

Description

technical field [0001] The invention belongs to a soaking plate for heat dissipation, in particular to a soaking plate with a composite capillary structure of foamed metal and copper powder. Background technique [0002] With the development of microelectronics technology, the calorific value per unit area of ​​electronic components is continuously increasing, but the volume is required to be smaller and smaller. Therefore, the heat dissipation problem of high heat flux components has become one of the key technical issues affecting the design of electronic devices. In the past two years, the traditional air-cooled heat dissipation has reached the limit of its heat dissipation capacity, while the liquid-cooled heat dissipation method has disadvantages such as high cost, complex structure, and risk of leakage that restrict its popularization and development. With the improvement of heat dissipation requirements, phase change heat dissipation elements made of the principle of ...

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