High-intensity water-resistance corrugated board and preparation method thereof

A corrugated board and water resistance technology, applied in the field of corrugated board, can solve the problems of insufficient effectiveness of network cross-linked structure, poor water resistance of corn binder, low water resistance of surface film formation, etc. The effect of mechanical bonding force and strong water resistance strength

Active Publication Date: 2013-05-15
DACHENG PACKAGING PROD SUZHOU
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  • Abstract
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AI Technical Summary

Problems solved by technology

[0006] Therefore, in order to improve the water resistance of corrugated boxes, the problem of poor water resistance of the corn binder must first be solved. After analysis, first of all, due to the large starch granules and the large space between them, there are more water genes on the main chain. High water content, when the free water is heated to 160°C, the free water will be evaporated, leaving a large space, reducing the presence of binders, thus affecting the bonding effect
Secondly, the effectiveness of the network cross-linked structure formed after the adhesive molding is insufficient, and then the water resistance of the surface film formed after the starch binder is dried is low, thus affecting the effect of water resistance and strength

Method used

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  • High-intensity water-resistance corrugated board and preparation method thereof
  • High-intensity water-resistance corrugated board and preparation method thereof

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Embodiment Construction

[0044] The present invention will be described in detail below with reference to the accompanying drawings and in combination with embodiments.

[0045] see figure 1 As shown, a high-strength water-resistant corrugated cardboard includes a face paper 1 and a back paper 3, a corrugated paper layer 2 is arranged between the face paper 1 and the back paper 3, and the peak surface of the corrugated paper layer 2 A high-strength water-resistant adhesive is coated between the face paper 1 and the back paper 3 .

[0046] Further, see figure 2 As shown, the corrugated paper layer 2 is sequentially composed of the first corrugated paper 201, the middle paper 4 and the second corrugated paper 202, and the outer peak surfaces of the first and second corrugated papers 201, 202 constitute the corrugated paper layer 2, the inner peak surfaces of the first and second corrugated papers 201, 202 and the middle paper 4 are bonded by the high-strength water-resistant adhesive.

[0047] Further...

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Abstract

The invention discloses a high-intensity water-resistance corrugated board and a preparation method of the high-intensity water-resistance corrugated board according to the national standard GB/T22873-2008. The high-intensity water-resistance corrugated board comprises surface paper and inner paper, wherein a corrugated paper layer is arranged between the surface paper and the inner paper; a high-intensity water-resistance adhesive is coated between the peak surface of the corrugated paper layer and the surface paper as well as the inner paper; a special water-resistance additive is added into the conventional corrugated board adhesive; and various technological parameters of a board automatic line are optimized by an ultrafine particle pulping technology, so that the water resistance of the corrugated board is greatly improved and is much higher than the advanced level of products of the same type in foreign countries.

Description

technical field [0001] The invention relates to the field of corrugated cardboard, in particular to a high-strength water-resistant corrugated cardboard and a preparation method thereof. Background technique [0002] In our country, most of the existing corrugated cardboard production lines use corn starch binder. The diameter of corn starch particles is 4-50um, and its composition is mainly glucose carbohydrates, accounting for about 20% in corn steep liquor, and the rest is water and a small amount of additives. Starch itself is insoluble in water. Starch will expand in volume as the temperature rises in water. After expansion and rupture, it will dissolve into a paste with water and become a viscous liquid. During the bonding process of cardboard, it will penetrate into the surface of the adherend In the hole, after the water evaporates, a physical and mechanical adhesion with a certain network crosslinking is formed. Its advantages are non-toxic, non-corrosive, non-pol...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): D21H27/40B32B29/08B31F1/20D21H21/14
Inventor 张惠忠卢思满
Owner DACHENG PACKAGING PROD SUZHOU
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