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Thin film forming apparatus and forming method for thin film

A technology of thin film and annular belt, which is applied in the direction of vacuum evaporation plating, coating, gaseous chemical plating, etc. It can solve the problems of the reduction of mechanical properties of the substrate, the application of thermal load, the deformation of the substrate, etc., and achieve high film forming speed and narrow gap , the effect of preventing deformation

Inactive Publication Date: 2010-09-29
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, when the temperature of the substrate rises excessively, the mechanical properties of the substrate are significantly reduced, and problems such as large deformation of the substrate and fusing of the substrate easily occur due to thermal expansion of the deposited film
In other film formation methods, although the heat source is different, the substrate is subjected to a thermal load during film formation, so the same problem exists

Method used

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  • Thin film forming apparatus and forming method for thin film
  • Thin film forming apparatus and forming method for thin film
  • Thin film forming apparatus and forming method for thin film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0090] figure 1 It is a figure which schematically shows the structure of an example of the substrate coolant mechanism which is a part of embodiment of this invention provided with the tension application member in the width direction. figure 1 (a) is the AA' sectional view of (b), figure 1 (b) is from Figure 4 A front view of the film formation source 27 looking at the vicinity of the opening 31 .

[0091] Near both ends in the width direction of the substrate in the vicinity of the opening, along the back surface of the substrate, endless belts 3 held by a plurality of support rollers 2 are in contact with the back surface of the substrate in pairs and rotate (circularly). In addition, the surface of the subject of thin film formation facing the film formation source is defined as the front surface of the substrate, and the opposite surface is defined as the rear surface of the substrate. The width of the annular body 3 is preferably 2 to 50 mm. When the width of the a...

Embodiment approach 2

[0098] figure 2 It is a figure which schematically shows the structure of another example of the substrate cooling mechanism which is a part of embodiment of this invention provided with the tension|tensile_strength applying member in the width direction. figure 2 (a) is the AA' sectional view of (b), figure 2 (b) is from Figure 4 A front view of the film formation source 27 looking at the vicinity of the opening 31 .

[0099] Embodiments other than the vicinity of the opening are similar to Embodiment 1, and thus description thereof will be omitted.

[0100] In Embodiment 2, the substrates are successively clamped by the clamp mechanisms 5 arranged at both ends in the width direction of the substrate in the vicinity of the opening. Fixture mechanism such as Figure 9 As in the example shown in the schematic diagram, it has (a) spring type, (b) pneumatic type, (c) electrostatic type, etc. clamping function, and air gap type, spring type, etc. opening function. By oper...

Embodiment approach 3

[0104] image 3 It is a figure which schematically shows the structure of another example of the substrate cooling mechanism which is a part of embodiment of this invention provided with the tension|tensile_strength applying member in the width direction. image 3 (a) is the AA' sectional view of (b), image 3 (b) is from Figure 4 The front view of the film forming source 27 watching the vicinity of the opening 31, image 3 (c) is a partially enlarged view of one rotating sliding body located on the right side in (b). but, image 3 In (c), the shielding plate 29 is omitted.

[0105] Embodiments other than the vicinity of the opening are similar to Embodiment 1, and thus description thereof will be omitted.

[0106] In Embodiment 3, tension is applied in the width direction of the substrate to the opening 31 by the rotary sliders 12 disposed near both ends in the width direction of the substrate 21 . The material of the portion of the rotating slider that contacts the su...

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Abstract

Provided is a thin film forming apparatus uniformly and sufficiently cooling a substrate. The thin film forming apparatus of this invention forms a thin film on the long substrate in a vacuum and is provided with a cooling body 1 arranged in the vicinity of the backside of the substrate during conveying at an opening part 31, a gas introducing means introducing gas between the cooling body 1 and the substrate 21, and a substrate restraining means 3 restraining the vicinity of both edges in the width direction of the travelling substrate at the opening part 31.

Description

technical field [0001] The present invention relates to a thin film forming device and a forming method. Background technique [0002] Thin film technology is widely used in the high performance and miniaturization of devices. In addition, the thin film of the device not only directly benefits the user, but also plays an important role in the protection of the earth's resources and the reduction of power consumption. [0003] In the development of such thin film technology, it is indispensable to respond to the demands from the industrial application side such as high efficiency, stabilization, high productivity, and cost reduction of thin film manufacturing methods, and continuous efforts have been made in this regard. [0004] In terms of high productivity of thin films, film formation technology with high deposition rates is essential, and high deposition rates have been developed in thin film production such as vacuum evaporation, sputtering, ion plating, and CVD. In a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/56C23C14/24C23C16/455C23C16/54
CPCC23C16/52C23C16/545C23C16/466C23C14/562C23C16/463C23C14/541
Inventor 本田和义神山游马柳智文篠川泰治山本昌裕
Owner PANASONIC CORP
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