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Curable resin composition

A curable resin and compound technology, applied in the direction of electrical solid devices, semiconductor/solid device parts, electrical components, etc., can solve the problems of insulation reliability degradation, difficulty in removing chloride ion impurities, etc., and achieve good operability and excellent PCT Effects of durability and high insulation reliability

Active Publication Date: 2012-08-08
TAIYO HLDG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Common epoxy acrylate modified resins have the following problems: the epoxy resin used as a raw material basically already contains a large amount of chloride ion impurities that deteriorate the insulation reliability of insulating materials. After epoxy acrylate modification, the chloride ion impurities very difficult to remove

Method used

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  • Curable resin composition
  • Curable resin composition
  • Curable resin composition

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0217] Add 119.4 g of novolak type cresol resin (manufactured by Showa Polymer Co., Ltd., trade name "ShonolCRG951", OH equivalent: 119.4), 1.19g of potassium hydroxide and 119.4g of toluene were replaced with nitrogen in the system while stirring, and the temperature was raised by heating. Then, slowly drop 63.8g of propylene oxide, at 125~132℃, 0~4.8kg / cm 2 The reaction was carried out for 16 hours.

[0218] Afterwards, be cooled to room temperature, in this reaction solution, add and mix 1.56g 89% phosphoric acid and potassium hydroxide is neutralized, obtain the ring of the novolak type cresol resin that is 62.1%, hydroxyl value 182.2g / eq. Propylene oxide reaction solution. This is a substance in which an average of 1.08 moles of alkylene oxide was added per equivalent of phenolic hydroxyl group.

[0219] The obtained 293.0 g of the alkylene oxide reaction solution of the novolak type cresol resin, 43.2 g of acrylic acid, 11.53 g of methanesulfonic acid, 0.18 g of methylh...

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Abstract

The invention provides a cured resin composition and a cured product thereof. The cured resin composition has good operability, high photosensitivity and the cured product thereof has excellent PCT resistance and high insulation reliability when applied in a printed circuit board and semiconductor packaging. The cured resin composition comprises a carboxyl resin which does not take the epoxy resin as an initial material, a carboxyl photosensitive resin which is obtained by reaction of the carboxyl resin and a compound including cyclic ether and alkene unsaturated group in a molecule, and a light polymerization initiator.

Description

technical field [0001] The present invention relates to curable resin compositions used as, for example, solder resists for printed circuit boards. Background technique [0002] From the standpoint of high precision and high density, currently, in the solder resists of some consumer printed circuit boards and almost all industrial printed circuit boards, image formation by development after ultraviolet irradiation and complete completion by heat and / or light irradiation are used. Cured (this cured) liquid developing solder resist. In addition, from the viewpoint of environmental problems, alkali-developing photoresists using a dilute alkaline aqueous solution as a developer have become mainstream and widely used (for example, refer to Patent Document 1 and the like). [0003] In recent years, solder resists have been required to be more operable and perform better in response to higher densities of printed circuit boards associated with reductions in weight, thickness and s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L71/02C08L63/10G03F7/004H05K1/02H01L23/29
Inventor 伊藤信人有马圣夫
Owner TAIYO HLDG CO LTD
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