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Solar wafer transfer storage box

A technology for solar silicon wafers and storage boxes, which is applied in sustainable manufacturing/processing, climate sustainability, semiconductor devices, etc., can solve the problems of many materials, large amount of use, and difficult to absorb, so as to reduce dust pollution and facilitate storage. The effect of storage and reduction of contact area

Inactive Publication Date: 2010-10-20
EGING PHOTOVOLTAIC TECHNOLOGY CO LTD
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  • Application Information

AI Technical Summary

Problems solved by technology

[0003] First, the bottom surface of the silicon wafer storage pit is flat, and the silicon wafer is not easy to absorb after contacting the bottom surface, and is easy to be polluted. When the silicon wafer storage pit accidentally falls into hard particles, put the silicon wafer into it, the bottom layer the silicon wafer will be crushed;
[0004] Second, there are many materials and high cost. This kind of silicon wafer transfer storage box is a solid structure, and its material is high-quality corrosion-resistant plastic. The price of each box is about 15 yuan, and the weight is too large;
[0005] Third, it takes up a lot of space and is not easy to store. Due to the large number of silicon wafer transfer storage boxes used, it is difficult to store and keep them at ordinary times. Not only does it take up a lot of space, but it is also inconvenient to stack

Method used

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Embodiment Construction

[0017] The following is attached with the manual Figure 1-Figure 5 The details are as follows:

[0018] The silicon chip transfer storage box of the present invention is a hollow quadrangular pyramid body surrounded by four facets 1 and a table top 2, and the silicon chip storage pit 3 and the blowing pit 4 are all arranged in the hollow quadrangular pyramid In the table body, the upper openings of the silicon wafer storage pit 3 and the air blowing pit 4 are flush with the table top 2, the bottom surfaces of the silicon wafer storage pit 3 and the air blowing pit 4 are flush with the bottom edge of the facet 1, and the silicon wafer The cross-sectional shapes of the chip storage pit 3 and the blowing pit 4 are both cone-shaped, with a large upper opening and a small lower opening. There are gaps 8; two blowing pits 4 are arranged at the opposite corners of the silicon wafer storage pit 3, and protruding ribs 5 are provided at the bottom of the silicon wafer storage pit 3 an...

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Abstract

The invention relates to a solar wafer transfer storage box which is enclosed from facets and table facets; the table facets are provided with wafer storage pits and air blowing pits; the two air blowing pits are arranged at across corners of the wafer storage pits; convex ribs are arranged at the bottom of the wafer storage pits and the air blowing pits; the cross sections of the wafer storage pits and the air blowing pits are conical with bigger upper ends and smaller lower ends; and gaps are left between the back sides of the wafer storage pits and the air blowing pits and the back sides of the four facets. The whole wafer transfer storage box is designed into conical, and is provided with a bigger upper end a smaller lower end; and the wafer storage boxes with the structure can be mutually sleeved to store, so that the occupied space is little, the used material is little and the weight is light. The convex ribs are arranged at the bottom of the wafer storage pits and the air blowing pits, thereby enhancing the strength of the bottom of the wafer storage pits and the air blowing pits, reducing the contact area of wafers at the bottommost and the bottom surface of the wafer storage pits, preventing the wafers from being crushed by granule material, and simultaneously further reducing the possibility of being polluted by dust.

Description

Technical field: [0001] The invention relates to a silicon chip container for solar cell production, in particular to a solar silicon chip transfer and transportation device. Background technique: [0002] In the production process of solar cells, silicon wafers need to go through several processing procedures. During the process of transfer or transportation, a large number of transfer storage boxes must be used, especially for artificial suction sheet placement after PECVD texturing. The back of the silicon wafer can bear a large weight, and the silicon wafer at the bottom of the box should be less polluted, and it should also be designed to match the air blowing port of the printing machine suction robot arm. The currently used silicon wafer transfer storage box is a solid square plastic table body, with a square storage pit corresponding to the size of the silicon wafer on the upper end surface, and a hole for the blowing pipe to extend into the opposite corner of the si...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/18H01L21/673H01L21/683
CPCY02P70/50
Inventor 巢鹏瑜
Owner EGING PHOTOVOLTAIC TECHNOLOGY CO LTD
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