Integral cooling device for high-power optical fiber laser or amplifier
A technology for fiber lasers and fiber amplifiers, used in lasers, laser parts, phonon exciters, etc., can solve the inconvenience of high-power fiber lasers or amplifier modularization, cannot provide pump coupler cooling at the same time, and fiber length is limited. and other problems to achieve the effect of increasing the scope of application, preventing fusing or aging, and running for a long time
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Publication Date
- 2010-10-20
Smart Images
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Abstract
Description
technical field
[0001] The invention relates to a cooling device, in particular to an integral cooling device for a high-power fiber laser or a high-power fiber amplifier. Background technique
[0002] When the rare earth element-doped fiber is used in a high-power fiber laser or a high-power fiber amplifier, the doped medium in the fiber generates laser light under the action of pump light, and generates a lot of heat at the same time. If the heat in the fiber is not discharged in time, it will cause the temperature of the fiber to rise, resulting in a decrease in the quality and efficiency of the output laser beam; it will even affect the polymer used to protect the fiber at the outermost layer of the fiber, causing the polymer to age or even fail. It is directly related to the safe and stable operation of high-power lasers or amplifiers.
[0003] At present, there are patent applications (Chinese patents: 200810048538.0 and 200820155746.X) and practical application devic...
Examples
Embodiment Construction
[0015] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but the protection scope of the present invention should not be limited thereby.
[0016] Figure 1 to Figure 6 A specific example of the invention is given.
[0017] figure 1 It is a schematic diagram of the external structure of a specific embodiment of the cooling device provided by the present invention. As shown in the figure, the cooling device includes a cooling plate 1 and a heat conduction cover plate 2 , and is connected to a water cooler through a conduit 3 . figure 2 for figure 1 The internal structure schematic diagram of the illustrated embodiment, as shown in the figure, the cooling plate 1 is composed of a cooling plate main body 4 , a front sealing cover 5 and a rear sealing cover 6 . The main body of the cooling plate 4 is a flat metal plate, and the channel 14 runs through the inside so that the cooling liquid can flow ins...