Liquid metal heat radiation based high-power LED light source of threaded connection structure

Abstract

The invention discloses a liquid metal heat radiation based high-power LED light source of threaded connection structure, comprising an LED chip, a fluorescent glue layer, a screw package substrate, room-temperature liquid metal, a radiator with threaded holes and sealing layers, wherein the upper end of the screw package substrate is provided with a pit and the side of the lower end of the screw package substrate is provided with screws; the LED chip is installed in the pit in the screw package substrate and is covered by the fluorescent glue layer; the screw package substrate is installed on the radiator with threaded holes; gaps exist between the threads and are filled with the room-temperature liquid metal; and the screw package substrate and the radiator with threaded holes are sealed by the sealing layers. The light source adopts the high-heat conductivity of the liquid metal to effectively solve the problem of heat contact resistance between the high-power LED package substrate and the radiator, thus realizing better heat conduction effect, and transmits the heat generated by the LED chip out to guarantee the junction temperature of the LED chip to maintain at lower level, thus improving the operation reliability and the service life of the high-power LED.

Description

Technical field [0001] The invention relates to an illumination light source, in particular to a high-power LED light source based on a threaded connection structure for liquid metal heat dissipation. Background technique [0002] LED light source is a new generation of green lighting source, its power consumption is only one-tenth of ordinary incandescent lamp, but the life span is more than ten times longer. In addition, LED light sources also have the advantages of small size, sturdiness and durability, and rich colors. In order to meet the requirements of higher light intensity, the LED light source is realized by increasing the output power of a single chip or adopting an LED array. In an ideal situation, matched optical materials and appropriate packaging structures can give full play to the high-efficiency luminous performance of LEDs and convert most of the electrical energy into light. However, due to the very small area of ​​the LED chip, a large amount of heat cannot...

AI Technical Summary

Problems solved by technology

However, these materials have very small thermal conductivity and are prone to aging, which affects the heat dissipation and long-term stability of the device

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