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Resin composition for encapsulating optical semiconductor element

A technology of optical semiconductor and composition, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problem of not being able to claim to provide thermal shock resistance, etc.

Active Publication Date: 2013-09-18
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, even with these two types of compositions, cracking can still be observed during the temperature cycling test of the cured product, neither type of composition can be claimed to provide fully satisfactory thermal shock resistance

Method used

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  • Resin composition for encapsulating optical semiconductor element
  • Resin composition for encapsulating optical semiconductor element
  • Resin composition for encapsulating optical semiconductor element

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～6， comparative Embodiment 1

[0104]

[0105] Compositions having the formulations shown in Table 1 were prepared using the resins obtained above. In Table 1, for each component other than the curing agent, the listed numbers represent "parts by mass". Other components used in the composition are listed below.

[0106] (C) Curing agent: 4-methylhexahydrophthalic anhydride (RIKACID MH, manufactured by New Japan Chemical Co. Ltd.)

[0107] (D) curing catalyst: season Salt (UCAT5003, manufactured by San-Apro Ltd.)

[0108] Silane coupling agent: 3-mercaptopropylmethyldimethoxysilane (KBM-802, manufactured by Shin-Etsu Chemical Co., Ltd.)

[0109] Epoxy resin: 3,4-epoxycyclohexylmethyl 3',4'-epoxycyclohexanecarboxylate (CELLOXIDE 2021P, manufactured by Daicel Chemical Industries, Ltd.)

Embodiment 1

[0111] To obtain the composition, the following components were melt mixed: 80 parts by mass of resin 1, 20 parts by mass of resin 4, an amount of curing agent providing 1 mol of anhydride groups for every 1 mol of all epoxy groups in resins 1 and 4 and for each 100 parts by mass of the mixture of resins 1 and 4 and curing agent, 0.39 parts by mass of curing catalyst and 0.25 parts by mass of silane coupling agent. Melt mixing was carried out by first melting the curing agent and curing catalyst in an oven at 60° C., and then mixing with other components at 2,000 rpm for 1 min using a mixer (product name: Thinky Mixer, manufactured by Thinky Corporation), and then at 2,200 rpm. Degassing at rpm for 1min.

Embodiment 2

[0113] To obtain the composition, melt mix the following components in the same manner as in Example 1: 80 parts by mass of resin 1, 20 parts by mass of resin 5, in an amount of providing 1 mol of anhydride for every 1 mol of all epoxy groups in resins 1 and 5 Group curing agent and 0.39 parts by mass curing catalyst and 0.25 parts by mass silane coupling agent per 100 parts by mass of the mixture of resins 1 and 5 and curing agent.

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PUM

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Abstract

The present invention provides a resin composition for encapsulating an optical semiconductor element. The resin composition includes (A) a first organosilicon resin, having an unit containing a non-aromatic group which contains an epoxy group and an unit composed by a linear di-organopolysiloxane chain segment, (B) a second organosilicon resin, having an unit containing a non-aromatic group which contains an epoxy group and an unit containing a di-organosiloxygen unit, (C) a curing agent and (D) a curing catalyst. The composition has favorable curing performance and heat resistance color changing performance.

Description

technical field [0001] The present invention relates to a composition for encapsulating an optical semiconductor element, more particularly, to a composition for encapsulating an optical semiconductor element in which a base resin consists essentially of a silicone resin, and which has excellent heat discoloration resistance and Excellent curability. Background technique [0002] Conventionally, epoxy resin compositions have been widely used to encapsulate optical semiconductor elements. These epoxy resin compositions generally contain a cycloaliphatic epoxy resin as a base resin, a curing agent and a curing catalyst. The optical semiconductor element is generally encapsulated using a casting or die casting method or the like by pouring a resin composition into a mold in which the optical semiconductor element has been positioned and then curing the resin composition. However, as the brightness and power output of LEDs increased, epoxies began to suffer from discoloration ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L83/06C08K5/12H01L33/56
Inventor 浜本佳英柏木努
Owner SHIN ETSU CHEM IND CO LTD
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