34results about How to "Excellent heat discoloration resistance" patented technology

The present invention provides a printed wiring board comprising: a conductor circuit on an insulating substrate, a white solder resist layer which is composed of a photosensitive resin composition on the insulating substrate having the conductor circuit, and a protective layer which is composed of a silicone resin composition on the white solder resist layer. The inventive printed wiring board shows superior thermo-discoloration resistivity and excellent patterning resolution.

The present invention relates to a negative photosensitive resin composition which is sensitive to long wavelength ultraviolet rays, and more specifically, to a negative photosensitive resin composition comprising: a) one or a mixture of copolymers selected from i) an acrylic copolymer, ii) a polyimide-based copolymer, and iii) a siloxane-based copolymer; b) a photoinitiator; and c) an acridine-based photosensitizer having a specific structure. According to the present invention, the negative photosensitive resin composition has excellent resolution, transmittance, thermochromism resistance, adhesive force and the like, particularly, has excellent sensitivity at long wavelength ultraviolet rays of 405-435 nm, and thus is appropriate for use in an exposure device for the exclusive use of GH-line or a next generation digital exposure device.

An organic modified silicone resin composition includes: (A) an addition reaction product having two addition reactive carbon-carbon double bonds in one molecule, being a product of an addition reaction of (a) a compound shown by the general formula (1) having SiH groups and (b) a polycyclic hydrocarbon having addition reactive carbon-carbon double bonds; (B) a siloxane having an SiH group and an organic group substituted with an alkoxysilyl group and / or a siloxane having an SiH group and an organic group substituted with an epoxy group; (C) a compound having three or more SiH groups in one molecule; (D) a catalyst; and (E) fumed inorganic oxide. The formulation amount of the component (E) is 1 to 10 parts by mass relative to 100 parts by mass of the total amount of the components (A), (B), and (C); and having a viscosity of 10 to 100 Pa·s at 25° C.

An addition curable type silicone resin composition includes (a) an organopolysiloxane having an alkenyl group bonded to a silicon atom, (b) an organopolysiloxane represented by the formula, (R1R22SiO1 / 2)m(R1R2SiO2 / 2)n(R22SiO2 / 2)p(R1SiO3 / 2)q(R2(OR3)SiO2 / 2)r(SiO4 / 2)s, (c) an organohydrogen polysiloxane represented by R4aHbSiO(4-a-b) / 2), (d) a platinum group metal catalyst, and (e) a polyorganometallosiloxane containing an Si—O—Ce bond, and an Si—O—Ti bond, and contents of Ce and Ti of which are each 50 to 5,000 ppm, which cures by heating. According to this constitution, it is provided an addition curable type silicone resin composition which can provide a cured product excellent in transparency, and less change in hardness and weight loss under high temperature conditions.

Provided are a resin composition for general-purpose LED reflectors, which discolors little through thermal deterioration and is excellent in heat discoloration resistance, which can provide an LED lamp using it and having a long life, which is relatively inexpensive and has good storage stability, and which is excellent in handleability and workability, and an LED reflector and an LED luminaire using the resin composition.The resin composition is a dry-type unsaturated polyester resin composition containing at least an unsaturated polyester resin, a polymerization initiator, an inorganic filler, a white pigment, a release agent and a reinforcing material, wherein the unsaturated polyester resin is within a range of from 14 to 40% by mass relative to the entire amount of the composition, the total amount of the inorganic filler and the white pigment is within a range of from 44 to 74% by mass relative to the entire amount of the composition, and the proportion of the white pigment to the total amount of inorganic filler and the white pigment is at least 30% by mass.

Disclosed is a photosensitive resin composition that has desired characteristics. The photosensitive resin composition contains (A) a component that is a copolymer having a structural unit represented by formula (1) and at least one structural unit represented by formula (2), and (B) a component that is a photosensitizer. (In the formulae, the two Xs each independently represent a hydrogen atom, an alkyl group having 1-5 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, a phenyl group, or a benzyl group, and Y represents a hydrogen atom, an alkyl group having 1-5 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, a phenyl group, or a benzyl group. However, a portion or all of the hydrogen atoms in said alkyl group, said cycloalkyl group, said phenyl group, or said benzyl group may be replaced by a halogen atom, a carboxyl group, a hydroxyl group, an amino group, or a nitro group).

Disclosed is a photocurable coating material which is cured by ultraviolet light, electron beam, radiation or the like. This coating material is excellent in thermal discoloration resistance, adhesion to a base, abrasion resistance, water resistance and impact resistance. Specifically disclosed is a photocurable coating material characterized by containing 5-95 parts by weight of a urethane acrylate (U), 5-95 parts by weight of an acrylate compound (M) and 0.1-15 parts by weight of a photoinitiator (C) per 100 parts by weight of the total of the components (U) and (M). This photocurable coating material is also characterized in that the urethane acrylate (U) contains at least one or more diisocyanates (a) selected from the group consisting of hydrogenated xylylenediisocyanate and hydrogenated methylene bisphenylene diisocyanate, and a compound (b) containing a hydroxyl group and a (meth)acrylate group. The photocurable coating material is further characterized in that the acrylate compound (M) has two or more acrylate groups in a molecule with an acrylate group content of 5-12 mmol / g, while containing no aromatic ring structure.

A thermosensitive recording medium is provided that is excellent in heat discoloration resistance in the blank portions and in bar code readability. It also has excellent water resistance and printing (recording) run-ability. The thermosensitive recording medium includes a support, a thermosensitive recording layer installed on the support, and a protective layer on the thermosensitive recording layer. The thermosensitive recording layer contains two kinds of electron accepting color developing agents, a sulfonic acid compound and a diphenyl sulfone compound. Both the thermosensitive recording layer and the protective layer contain crosslinking agents, and at least one, and preferably both, of the thermosensitive recording layer and the protective layer contain an ammonium zirconium carbonate as the crosslinking agent.

The present invention provides a resin composition for encapsulating an optical semiconductor element. The resin composition includes (A) a first organosilicon resin, having an unit containing a non-aromatic group which contains an epoxy group and an unit composed by a linear di-organopolysiloxane chain segment, (B) a second organosilicon resin, having an unit containing a non-aromatic group which contains an epoxy group and an unit containing a di-organosiloxygen unit, (C) a curing agent and (D) a curing catalyst. The composition has favorable curing performance and heat resistance color changing performance.

A radiation-sensitive resin composition which comprises an alicyclic olefin resin to which groups having aromatic groups and polar groups are attached, an acid generator, a crosslinking agent, and a solvent and which exhibits low permittivity and excellent flatness, transparency and solvent resistance and is excellent in resolution, retention of film thickness, pattern shape, and thermal discoloration resistance; a method for the formation of patterned resin films by the use of the composition; patterned resin films made by the method; and use of the films in electronic components.

A curable resin composition is provided which uses a fumarate copolymer which is excellent in thermal discoloration resistance as a binder component and is capable of forming details of a color filter. The curable resin composition of the present invention is a photocurable resin composition for forming a protective layer, RGB pixels, a black matrix or a spacer of a color filter, and contains as a binder component a fumarate copolymer having at least a molecular structure wherein a constituent unit represented by the following Formula 1 and a constituent unit having an acidic functional group(s) are linked, preferably further having a constituent unit with an ethylenically unsaturated bond:wherein, each of R1 and R2 is independently a branched C3-8 alkyl group which may be substituted, or a C4-8 cycloalkyl group which may be substituted.

The aluminum-zinc plated steel sheet according to the present invention includes a plated steel sheet and a covering film that covers the plated steel sheet. The covering film contains a basic compound of transition metal other than cobalt and chromium, and metallic cobalt, or metallic cobalt and a cobalt compound. An amount of the covering film per one side is within a range of 0.01 to 0.8 g / m2. An amount in terms of mass of transition metal other than cobalt in the covering film per one side of the plated steel sheet is within a range of 4 to 400 mg / m2. An amount in terms of mass of cobalt in the covering film per one side of the plated steel sheet is within a range of 0.1 to 20 mg / m2.

The present invention provides a rust-inhibiting paint composition comprising: a binder (a); zinc powder and / or zinc alloy powder (b); and glass powder (c) with a softening point of 400-700 DEG C. According to the composition, the rust-inhibiting paint composition can form a rust-inhibiting film having excellent weldability, forming a rust-inhibiting film having excellent rust-inhibiting properties due to the prevention of zinc oxidation even after the rust-inhibiting film is heated to a high temperature, e.g. 400-900 DEG C, and forming a rust-inhibiting film having excellent resistance to heat discoloration by adjusting the mass ratio of the glass powder (c) with respect to the zinc alloy powder (b). Applications using the rust-inhibiting paint composition are also provided.

A radiation-sensitive resin composition which comprises an alicyclic olefin resin to which groups having aromatic groups and polar groups are attached, an acid generator, a crosslinking agent, and a solvent and which exhibits low permittivity and excellent flatness, transparency and solvent resistance and is excellent in resolution, retention of film thickness, pattern shape, and thermal discoloration resistance; a method for the formation of patterned resin films by the use of the composition; patterned resin films made by the method; and use of the films in electronic components.

Provided are a resin composition for general-purpose LED reflectors, which discolors little through thermal deterioration and is excellent in heat discoloration resistance, which can provide an LED lamp using it and having a long life, which is relatively inexpensive and has good storage stability, and which is excellent in handleability and workability, and an LED reflector and an LED luminaire using the resin composition.The resin composition is a dry-type unsaturated polyester resin composition containing at least an unsaturated polyester resin, a polymerization initiator, an inorganic filler, a white pigment, a release agent and a reinforcing material, wherein the unsaturated polyester resin is within a range of from 14 to 40% by mass relative to the entire amount of the composition, the total amount of the inorganic filler and the white pigment is within a range of from 44 to 74% by mass relative to the entire amount of the composition, and the proportion of the white pigment to the total amount of inorganic filler and the white pigment is at least 30% by mass.

The invention relates to a solar backboard formed by multi-layer co-extrusion and online hot-pressing lamination of a weather-proof film. The solar backboard is formed by online hot-pressing lamination of a three-layer polyolefin co-extrusion film and the weather-proof film, wherein the thickness of the solar backboard is 350 [mu]m; the three-layer polyolefin co-extrusion film sequentially comprises a copolymerized PP functional layer, a polyolefin supporting layer and a bonding functional layer from outside to inside, and the thickness of the three-layer polyolefin co-extrusion film is 300 [mu]m; the weather-proof film is a PVF or PVDF film, and the thickness of the weather-proof film is 50 [mu]m; and the three-layer polyolefin co-extrusion film and the weather-proof film are extruded andattached synchronously on line, and the weather-proof film is located on the outer side of the copolymerized PP functional layer. The solar backboard has excellent impact resistance, long-term heat resistance, heat discoloration resistance, antistatic performance and dimensional stability, is free of layering and cracking, and achieves environmental stress cracking resistance and supporting performance of the supporting layer.

The invention belongs to the field of photovoltaics, and particularly relates to a co-extrusion type solar module back plate and a preparation method thereof. The solar module back plate integrally comprises an EVA coating, a first support layer, an EVA partition layer, a filling bonding layer, a metal plating layer, a second support layer and a weather-proof layer from bottom to top; a plurality of glass beads are fixed between the filling bonding layer and the metal plating layer; the solar module backboard has excellent impact resistance, heat resistance, heat discoloration resistance and light weight, the reflective layer performs condensation reflection on incoming sunlight to perform secondary irradiation on the photovoltaic cell panel, and therefore the conversion efficiency of the photovoltaic cell panel can be improved.

The present invention provides a surface treatment solution for producing a zinc-based plated steel sheet with a surface treatment film that does not contain a chromium compound in the surface treatment film and is resistant to discoloration by heat. , heat cracking resistance, corrosion resistance of the flat part, corrosion resistance after alkali degreasing, blackening resistance, stacking blackening resistance, water seepage resistance, solvent resistance, sweat resistance, coating adhesion and storage stability. excellent. The surface treatment liquid for zinc-based plated steel sheets of the present invention is characterized in that a silane coupling agent (A) having a glycidyl group, a tetraalkoxysilane (B), a zirconium carbonate compound (C), a glass transition Anionic polyurethane resin (D), vanadium compound (E), molybdic acid compound (F) and water at temperature (Tg) of 80°C to 130°C have pH of 8.0 to 10.0 and the addition amount of each component satisfies a predetermined relationship.

The present invention relates to a negative photosensitive resin composition which is sensitive to long wavelength ultraviolet rays, and more specifically, to a negative photosensitive resin composition comprising: a) one or a mixture of copolymers selected from i) an acrylic copolymer, ii) a polyimide-based copolymer, and iii) a siloxane-based copolymer; b) a photoinitiator; and c) an acridine-based photosensitizer having a specific structure. According to the present invention, the negative photosensitive resin composition has excellent resolution, transmittance, thermochromism resistance, adhesive force and the like, particularly, has excellent sensitivity at long wavelength ultraviolet rays of 405-435 nm, and thus is appropriate for use in an exposure device for the exclusive use of GH-line or a next generation digital exposure device.

The aluminum-zinc plated steel sheet according to the present invention includes a plated steel sheet and a covering film that covers the plated steel sheet. The covering film contains a basic compound of transition metal other than cobalt and chromium, and metallic cobalt, or metallic cobalt and a cobalt compound. An amount of the covering film per one side is within a range of 0.01 to 0.8 g / m2. An amount in terms of mass of transition metal other than cobalt in the covering film per one side of the plated steel sheet is within a range of 4 to 400 mg / m2. An amount in terms of mass of cobalt in the covering film per one side of the plated steel sheet is within a range of 0.1 to 20 mg / m2.

The present invention provides a fluoroelastomer composition excellent in heat discoloration resistance and moldability, and a molded article, a crosslinked article, and a covered electric wire using the fluoroelastomer composition. A fluorine-containing elastomer composition, characterized in that it contains fluorine-containing rubber (a) and fluorine-containing copolymer (b), and the aforementioned fluorine-containing copolymer (b) contains tetrafluoroethylene-based units (A) and ethylene-based unit (B), the molar ratio [(A) / (B)] of the aforementioned unit (A) to the aforementioned unit (B) is 25 / 75 to 80 / 20, and the crystallization temperature of the aforementioned fluorine-containing copolymer (b) is 100-210°C, the melt flow rate is 0.1-1000g / 10min, and the mass ratio [(a) / (b)] of the aforementioned fluorine-containing rubber (a) to the aforementioned fluorine-containing copolymer (b) is 80 / 20- 20 / 80.

Disclosed is a copper foil-for printed circuit boards-which is especially excellent in soft etching property and also superior in such properties as heat discoloration resistance, rust-proofing and solder-ability. The copper foil for printed circuit boards comprising a first layer formed by applying 12 to 50 mg / m2 of a sulfur-contained zinc alloy containing 0.1 to 2.5 percent by weight of sulfur on the surface on at least one side of the copper foil and a second layer formed of a chromate layer on the first layer by applying 0.5 to 2.5 mg / m2 of chromium and, if necessary, 1.5 to 6 mg / m2 of phosphorus. The process of treating the surface of copper foil for printed circuit boards comprising the steps of forming the first layer composed of a sulfur-contained zinc alloy by electrolysis by dipping at least the surface on one side of the copper foil in a solution containing a zinc compound and a sulfur compound and forming the second layer composed of chromate by electrolysis by dipping said first layer in a solution containing a chromium compound, or a chromium compound and a phosphorus compound.

The present invention provides a resin composition for encapsulating an optical semiconductor element. The resin composition includes (A) a first organosilicon resin, having an unit containing a non-aromatic group which contains an epoxy group and an unit composed by a linear di-organopolysiloxane chain segment, (B) a second organosilicon resin, having an unit containing a non-aromatic group which contains an epoxy group and an unit containing a di-organosiloxygen unit, (C) a curing agent and (D) a curing catalyst. The composition has favorable curing performance and heat resistance color changing performance.

The invention belongs to the field of photovoltaics, and specifically relates to a co-extruded solar module backplane and a preparation method thereof. The whole solar module backplane of the present invention consists of an EVA coating, a first support layer, an EVA partition layer, a filling Adhesive layer, metal coating, second support layer, weather-resistant layer, filled with a number of glass beads fixed between the adhesive layer and the metal coating; the solar module backsheet has excellent impact resistance, heat resistance, heat discoloration resistance At the same time, the reflective layer can concentrate and reflect the incoming sunlight to provide secondary irradiation for the photovoltaic panel, which can improve the conversion efficiency of the photovoltaic panel.

The present invention relates to a positive photosensitive resin composition, a display device and a pattern forming method thereof, and more particularly, to a photosensitive resin composition comprising: a) a 1,2-quinone diazide represented by the following formula (1) or (2); b) an acrylic acid copolymer; c) a silane coupling agent; and d) a solvent; wherein R1 in the formula (1) and R3 in theformula (2) each independently represent a hydrogen atom or a 1,2-quinone diazide sulfonate, and R2 in formula (1) and R4 in formula (2) each independently represent a hydrogen atom or a hydrocarbyl group having 1 to 20 carbon atoms, and at least one of R1 and R3 is 1,2-quinone diazide sulfonate.