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Photosensitive resin composition containing copolymer

A technology of photosensitive resin and composition, applied in the field of photosensitive resin composition, can solve the problems such as no indication of heat resistance, no description and no substitution, etc., and achieve reduced deformation, excellent heat resistance and solvent resistance, and excellent light resistance. sexual effect

Inactive Publication Date: 2012-05-30
NISSAN CHEM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, although it has been explained that the radiation-sensitive resin composition reported in this document can easily form a patterned film that can obtain high radiation sensitivity and is excellent in solvent resistance, heat resistance, transparency and thermal discoloration resistance, There is no suggestion of the shape of the pattern formed by the composition, its heat resistance
In addition, as a maleimide-based monomer, there is no description of unsubstituted maleimide

Method used

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  • Photosensitive resin composition containing copolymer
  • Photosensitive resin composition containing copolymer
  • Photosensitive resin composition containing copolymer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0090] Hereinafter, the present invention will be described in more detail based on examples and comparative examples, but the present invention is not limited to these examples.

[0091] [Measurement of weight-average molecular weight of polymers obtained from the following synthesis examples]

[0092] Device: GPC system manufactured by JASCO Co., Ltd.

[0093] Column: Shodex [registered trademark] KL-804L and 803L

[0094] Column oven: 40°C

[0095] Flow rate: 1ml / min

[0096] Eluent: tetrahydrofuran

[0097] [Synthesis of Polymer]

Synthetic example 1

[0099] Monoallyl isocyanuric acid 33g, N-cyclohexylmaleimide 15g, 1,4-di 88 g of alkanes were put into the flask, and the inside of the container was adjusted to 70°C to dissolve. Then, 2.4 g of 2,2'-azobis(isobutyrate) dimethyl and 1,4-bis A solution of 30 g of alkanes was added dropwise to the flask. Thereafter, it was heated to reflux for 8 hours, and then returned to room temperature, and the resulting solution was added to methanol to obtain 21 g of a polymer (copolymer) having a structural unit represented by the following formula (8) as a white powder. As a result of GPC analysis of the reaction product, the weight average molecular weight in terms of standard polystyrene was 8,400.

[0100]

Synthetic example 2

[0102] Monoallyl isocyanuric acid 13g, N-cyclohexylmaleimide 15g, maleimide 5g, 1,4-di Add 50 g of alkane into the flask and heat to reflux. Then, 1.6 g of 2,2'-azobis(isobutyrate) dimethyl and 1,4-bis A solution of 30 g of alkanes was added dropwise to the flask. Thereafter, it was heated to reflux for 10 hours, and then returned to room temperature, and the obtained solution was added to methanol to obtain 12 g of a polymer (copolymer) having a structural unit represented by the following formula (9) as a white powder. As a result of GPC analysis of the reaction product, the weight average molecular weight in terms of standard polystyrene was 12,900.

[0103]

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PUM

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Abstract

Disclosed is a photosensitive resin composition that has desired characteristics. The photosensitive resin composition contains (A) a component that is a copolymer having a structural unit represented by formula (1) and at least one structural unit represented by formula (2), and (B) a component that is a photosensitizer. (In the formulae, the two Xs each independently represent a hydrogen atom, an alkyl group having 1-5 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, a phenyl group, or a benzyl group, and Y represents a hydrogen atom, an alkyl group having 1-5 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, a phenyl group, or a benzyl group. However, a portion or all of the hydrogen atoms in said alkyl group, said cycloalkyl group, said phenyl group, or said benzyl group may be replaced by a halogen atom, a carboxyl group, a hydroxyl group, an amino group, or a nitro group).

Description

technical field [0001] The present invention relates to a copolymer using allyl isocyanuric acid as a raw material, and a photosensitive resin composition containing the copolymer. Furthermore, the present invention relates to a photosensitive resin composition capable of remarkably improving light resistance, transparency, heat resistance, thermal discoloration resistance, solvent resistance, crack resistance, and the like with respect to a film formed from the photosensitive resin composition. Background technique [0002] Conventionally, polyhydroxystyrene has been known as a material for forming microlenses. However, there are the following problems, and there is room for improvement. When the above-mentioned polyhydroxystyrene is used as a material for forming microlenses, the hemispherical shape of the microlenses tends to change due to high-temperature heating, making it difficult to form microlenses with stable shapes. In addition, polyhydroxystyrene tends to be ea...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/023C08F226/06G02B1/04
CPCC08F222/40G03F7/0233G02B1/04C08F226/02G03F7/40C08F222/402C08F226/06G02B1/041G03F7/0045
Inventor 岸冈高广
Owner NISSAN CHEM CORP
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