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Curable resin composition and method for forming cured coating film

A technology of curable resin and composition, which is applied in the direction of coating, photoplate-making process coating equipment, pattern surface photoplate-making process, etc., which can solve the problems of uneven coating film thickness and coating film defects, and achieve stable storage good sex effect

Inactive Publication Date: 2009-07-22
DAICEL CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, according to the study of the inventors of the present invention, when the coating film is formed by the slit coating method or the inkjet method, the thickness of the coating film may be locally uneven or the coating film may be damaged depending on the type of resin.

Method used

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  • Curable resin composition and method for forming cured coating film
  • Curable resin composition and method for forming cured coating film
  • Curable resin composition and method for forming cured coating film

Examples

Experimental program
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Embodiment

[0099] Hereinafter, the present invention will be described in more detail by way of examples, but the present invention is not limited by these examples. In addition, the numbers in parentheses after the compound indicate the boiling point at normal pressure. The degree of dispersion is a value of weight average molecular weight Mw / number average molecular weight Mn.

Synthetic example 1

[0101] Pass an appropriate amount of nitrogen into a 1L flask equipped with a reflux cooler, dropping funnel, and stirrer to form a nitrogen atmosphere, add 275 parts by weight of dipropylene glycol dimethyl ether (175° C.), and heat to 70° C. while stirring. Then, use a dripping pump to drop the following solution into the flask in about 4 hours. The solution is 55 parts by weight of methacrylic acid (MAA), 3,4-epoxytricyclo[5.2.1.0 2，6 ]decane-9-yl acrylate and 3,4-epoxytricyclo[5.2.1.0 2，6 ] Decane-8-base acrylate mixture [50:50 (molar ratio)] (E-DCPA) 180 parts by weight, and N-cyclohexylmaleimide (CHMI) 70 parts by weight dissolved in dipropylene glycol Formed in 170 parts by weight of dimethyl ether. On the other hand, a solution containing 2,2'-azobis(2,4-dimethylvaleronitrile) 30 Parts by weight were dissolved in 225 parts by weight of dipropylene glycol dimethyl ether. After the dropwise addition of the polymerization initiator was completed, the same temperature w...

Synthetic example 2

[0103] An appropriate amount of nitrogen was passed through a 1L flask equipped with a reflux cooler, a dropping funnel and a stirrer to form a nitrogen atmosphere, 345 parts by weight of dipropylene glycol dimethyl ether (175° C.) was added, and the mixture was heated to 70° C. while stirring. Then, use a dripping pump to drop the following solution into the flask in about 4 hours, the solution is 76 parts by weight of methacrylic acid (MAA), 3,4-epoxytricyclo[5.2.1.0 2，6 ]decane-9-yl acrylate and 3,4-epoxytricyclo[5.2.1.0 2，6 A mixture of ]decane-8-yl acrylate [50:50 (molar ratio)](E-DCPA) 303 parts by weight was dissolved in 220 parts by weight of dipropylene glycol dimethyl ether. On the other hand, a solution containing 2,2'-azobis(2,4-dimethylvaleronitrile) 70 The parts by weight were dissolved in 293 parts by weight of dipropylene glycol dimethyl ether. After the dropwise addition of the polymerization initiator was completed, the same temperature was maintained for a...

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Abstract

Disclosed is a curable resin composition containing a copolymer having a monomer unit (A) containing an alkali-soluble group and a monomer unit (B) corresponding to a curable group-containing polymerizable unsaturated compound, and an organic solvent having a boiling point at atmospheric pressure of not less than 180 DEG C. The ratio of the monomer unit (B) relative to the total monomer units constituting the copolymer is 5-95% by weight, and not less than 30% by weight of the monomer unit (B) is composed of a monomer unit corresponding to at least one compound selected from 3,4-epoxytricyclo[5.2.1.0]decane ring-containing compounds. This curable resin composition enables to form a coating film excellent in transparency, heat resistance and the like. In particular, no partial variations in coating thickness or coating defects occur when a coating film is formed by a slit coating method or inkjet method by using this curable resin composition.

Description

technical field [0001] The present invention relates to a compound containing 3,4-epoxy tricyclic [5.2.1.0 2，6 ] A curable resin composition of a copolymer of a decane ring, and a method for forming a cured coating film using the composition. More specifically, the present invention relates to a curable resin composition for use in semiconductor processes using deep ultraviolet rays, electron rays, ion beams, and a method for forming a cured coating film using the curable resin composition. Photolithography by active rays such as X-rays, or used to form insulating films, protective films, etc. provided in electronic components such as liquid crystal display elements, integrated circuit elements, and solid-state imaging elements. Background technique [0002] In general, in the field of manufacturing various electronic devices that require submicron order microfabrication represented by VLSI, further higher density and higher integration of devices are required. Therefore, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L33/14C08F220/32C09D133/14G03F7/033G03F7/038G03F7/16
CPCG03F7/038C09D133/068C08F220/06C08F220/28C08L2312/00C08L33/14C08F220/32C08J3/24C08F220/325C08F212/08C08F220/18C08F222/402
Inventor 森三佐雄高胁浩一二十轩年彦
Owner DAICEL CHEM IND LTD
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