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Radiation-sensitive resin composition, patterned resin film, method for formation of the film, and use thereof

A resin composition and sensitive technology, applied in the field of forming resin pattern films, can solve the problems of low productivity, inability to obtain heat discoloration resistance, inability to maintain transparency, etc.

Active Publication Date: 2005-08-17
ZEON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, although the resin film formed by using the above-mentioned radiation-sensitive resin composition is stable at a temperature lower than 200° C., sufficient thermal discoloration resistance cannot be obtained when heated to a high temperature above 200° C.
Transparent circuit boards made of resin films with poor thermal discoloration resistance discolor due to heat treatment at high temperatures, so transparency cannot be maintained
In order to suppress discoloration, heat treatment must be performed in an inert gas atmosphere with a particularly low oxygen concentration, so its productivity is low

Method used

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  • Radiation-sensitive resin composition, patterned resin film, method for formation of the film, and use thereof
  • Radiation-sensitive resin composition, patterned resin film, method for formation of the film, and use thereof

Examples

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Embodiment

[0095] Hereinafter, the present invention will be described more concretely with reference to synthesis examples, examples, and comparative examples. "Parts" and "%" in each example are based on mass (weight basis) unless otherwise specified.

Synthetic example 1

[0097] 8-methyl-8-methoxycarbonyltetracyclo[4.4.0.1 as an alicyclic olefin monomer 2，5 .1 7，10 ] 60 parts of dodec-3-ene, 40 parts of N-phenyl-(5-norbornene-2,3-dicarboxyimide), 72 parts of 1-hexene and 300 parts of toluene, add nitrogen gas In the reaction vessel, after heating to 60°C, add 0.248 parts of triethylaluminum 1.5 mol / liter toluene solution and modify under the condition of tert-butanol / methanol / tungsten=0.25 / 0.3 / 1 (molar ratio) WCl 6 3.7 parts of the solution (0.05 mol / liter) were stirred at 80° C. for 3 hours to perform ring-opening polymerization to obtain a ring-opened copolymer having a weight average molecular weight of 17,000. The polymerization conversion was about 100%.

[0098] Then, 1,000 parts of the obtained ring-opening copolymer solution was added to the autoclave, and RuHCl(CO)[P(C 6 h 5 ) 3 ] 19.5 parts, then add the air pressure to be 100Kg / cm 2 hydrogen gas, while stirring at a reaction temperature of 165° C. for 3 hours to carry out a hy...

Synthetic example 2

[0104] In addition to the composition of the alicyclic olefin monomer becomes 8-methyl-8-methoxycarbonyl tetracyclic [4.4.0.1 2，5 .1 7， 10 ] 70 parts of dodec-3-ene, 20 parts of N-phenyl-(5-norbornene-2,3-dicarboxyimide) and tetracyclo[4.4.0.1 2，5 .1 7，10 ] Except for 10 parts of dodec-3-ene, the others are the same as in Synthesis Example 1. After the ring-opening polymerization, the overlapping conversion rate is about 100%, the weight average molecular weight is 21,100, the hydrogen addition rate is 100%, and the hydrolysis rate is 97%. % of cycloaliphatic olefin resin (polymer A2).

[0105] This polymer A2, after 1 H-NMR spectrum analysis confirmed that it was a substance having repeating units (I), (II) and (III) represented by the following formulae.

[0106]

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Abstract

A radiation-sensitive resin composition which comprises an alicyclic olefin resin to which groups having aromatic groups and polar groups are attached, an acid generator, a crosslinking agent, and a solvent and which exhibits low permittivity and excellent flatness, transparency and solvent resistance and is excellent in resolution, retention of film thickness, pattern shape, and thermal discoloration resistance; a method for the formation of patterned resin films by the use of the composition; patterned resin films made by the method; and use of the films in electronic components.

Description

technical field [0001] The present invention relates to a radiation-sensitive resin composition whose solubility in a developer is changed by irradiation with activating radiation such as particle beams and electron beams. More specifically, the present invention relates to a radiation-sensitive resin composition suitable as a material for forming a resin pattern film excellent in transparency, which is a resin for electronic parts such as a protective film, a planarizing film, and an electrical insulating film. The present invention also relates to a method for forming a resin pattern film using the radiation-sensitive resin composition. Furthermore, this invention relates to the application of this resin pattern film as a resin film for electronic components. Background technique [0002] In electronic components such as liquid crystal display elements, integrated circuit elements, solid-state imaging elements, and color filters for liquid crystal displays, it is designed...

Claims

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Application Information

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IPC IPC(8): G03F7/038G03F7/039
CPCG03F7/0382G03F7/0395G03F7/039
Inventor 小出村顺司东广和
Owner ZEON CORP
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