Negative photosensitive resin composition

A technology of photosensitive resin and composition, applied in optics, opto-mechanical equipment, instruments, etc., can solve the problems of inappropriate application, slow sensitivity, slowness, etc.

Active Publication Date: 2013-04-17
DONGJIN SEMICHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing negative-type photosensitive resin composition is mainly sensitive to the UV wavelength of 365nm (i-line), but it is not sensitive or slowly sensitive to the long UV wavelength of 405nm to 435nm, so it is specially used in GH-line Problems with pat

Method used

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  • Negative photosensitive resin composition
  • Negative photosensitive resin composition
  • Negative photosensitive resin composition

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0056] Synthesis Example 1 (preparation of acrylic copolymer)

[0057] A mixed solution of 400 parts by weight of propylene glycol monoethyl ether acetate, 30 parts by weight of methacrylic acid, 30 parts by weight of styrene, and 40 parts by weight of aryl methacrylate was put into a flask equipped with a cooler and a stirrer. After the liquid composition was well mixed at 600 rpm in a mixing container, 15 parts by weight of 2,2'-azobis(2,4-dimethylvaleronitrile) was added. Slowly raise the temperature of the polymerization mixed solution to 70°C, and maintain this temperature for 8 hours, then cool at room temperature, and add 500 ppm of hydroxybenzophenone as a polymerization inhibitor to obtain an acrylic copolymer with a solid content concentration of 20% by weight. thing. The weight average molecular weight of the obtained acrylic copolymer was 10,000. At this time, the weight average molecular weight is a polystyrene conversion average molecular weight measured using ...

Synthetic example 2

[0058] Synthesis example 2 (preparation of polyimide copolymer)

[0059]Add 50 parts by weight of 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane and 50 parts by weight of 4,4-(hexafluoro-isopropylidene)diphthalic anhydride into a flask with a cooler and a stirrer parts by weight, and NMP400 parts by weight were added at room temperature, stirred for 24 hours, and reacted. At this time, the concentration of the solution was 20% by weight of solid matter. After that, in order to remove the water generated in the imidization reaction, the same amount of xylene as that of the NMP was added to the polyamic acid generated by the reaction, and reacted at 160° C. for 5 hours to prepare polyimide . Under a nitrogen atmosphere, after dissolving soluble polyimide (6FDA / BAPAF) in DMAc, drop methacryloyl chloride as a photosensitive group and an equivalent amount of triethylamine (TEA), and react at 0°C for 12 hours to prepare photosensitive polyimide copolymers. The weight average ...

Synthetic example 3

[0060] Synthesis Example 3 (preparation of siloxane copolymer)

[0061] Add 40 parts by weight of phenyltriethoxysilane, 20 parts by weight of tetraethoxysilane and 40 parts by weight of methacryloxypropyl trimethoxysilane as reactive silanes in a flask with a cooler and a stirrer , After adding 100 parts by weight of propylene glycol monoethyl ether acetate as a solvent and performing nitrogen substitution, it was stirred slowly. 40 parts by weight of ultrapure water and 3 parts by weight of oxalic acid used as a catalyst were further added to the reaction solution, and then stirred again slowly. One hour later, the temperature of the reaction solution was raised to 60° C., and the temperature was maintained for 10 hours. After solution polymerization, the reaction solution was cooled at room temperature to complete the reaction. Next, after removing the alcohol solvent and residual moisture generated during the reaction by vacuum drying, it was diluted with 300 parts by wei...

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Abstract

The present invention relates to a negative photosensitive resin composition which is sensitive to long wavelength ultraviolet rays, and more specifically, to a negative photosensitive resin composition comprising: a) one or a mixture of copolymers selected from i) an acrylic copolymer, ii) a polyimide-based copolymer, and iii) a siloxane-based copolymer; b) a photoinitiator; and c) an acridine-based photosensitizer having a specific structure. According to the present invention, the negative photosensitive resin composition has excellent resolution, transmittance, thermochromism resistance, adhesive force and the like, particularly, has excellent sensitivity at long wavelength ultraviolet rays of 405-435 nm, and thus is appropriate for use in an exposure device for the exclusive use of GH-line or a next generation digital exposure device.

Description

technical field [0001] The present invention relates to a negative-type photosensitive resin composition, and more specifically relates to a composition with excellent resolution, transmittance, thermal discoloration resistance, adhesion, etc., especially excellent sensitivity in 405nm-435nm UV long wavelength, so it is suitable for Negative photosensitive resin composition for GH-line dedicated exposure machine or next-generation digital exposure machine. Background technique [0002] In TFT-type liquid crystal display elements or integrated circuit elements, not only when forming passivation (Passivation) insulating films, gate insulating films, planarizing films, etc., which are arranged between layers for insulating wiring, but also for forming columnar For spacers, protective films, and color resists, negative photosensitive resin compositions are mainly used. [0003] As an organic insulating film and gate insulating film, column spacer, protective film, planarizing f...

Claims

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Application Information

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IPC IPC(8): G03F7/075G03F7/027G03F7/028
CPCG03F7/031G03F7/032G03F7/033G03F7/037G03F7/0757G03F7/0382
Inventor 吕泰勋金炳郁尹赫敏丘冀赫尹柱豹金东明申洪大金珍善李相勋禹昌旼
Owner DONGJIN SEMICHEM CO LTD
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